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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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UPD360 датащи(PDF) 207 Page - Microchip Technology |
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UPD360 датащи(HTML) 207 Page - Microchip Technology |
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207 / 221 page  2016-2017 Microchip Technology Inc. DS00002084C-page 207 UPD360 16.3 Package Thermal Specifications 16.4 Current Consumption TABLE 16-1: PACKAGE THERMAL PARAMETERS Parameter Symbol °C/W Thermal Resistance Junction to Ambient JA 74.2 Thermal Resistance Junction to Top of Case JC 25.2 Thermal Resistance Junction to Board JB 47.9 Thermal Resistance Junction to Bottom of Case JT 8.8 Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51. TABLE 16-2: POWER DISSIPATION Parameter Symbol Max Units Power Dissipation Pdis 825 mW Note: This is the worst-case power dissipation as a consequence of maximum loading (before current-limiting protections take effect) upon the internal VBUS power switch, VCONN power switch, 3.3V power-ORing switch, analog blocks, and core digital logic. TABLE 16-3: 3V3_ALW DEVICE CURRENT CONSUMPTION Power State 3V3_ALW Supply Current Typical Max Units SLEEP 14 µA STANDBY 70 µA ACTIVE_PPC_OFF 70 µA ACTIVE_PPC_ON 10 mA ACTIVE and PD packet transmitting +5 See Note 4 mA Note 1: This table details the power consumption of the UPD360 device as measured during various modes of operation. Power dissipation is determined by temperature, supply voltage, and external source/sin k requirements. Maximum values represent very short bursts of activity over a small amount of time. Typical values represent averaged current consumption over time. 2: SLEEP power state is achieved with PWR_DN pin asserted 3: STANDBY is equivalent to USB Type-C™ specification’s Unattached.SRC/Unattached.SNK 4: 3V3_VBUS current is ~0µA except during bus-powered conditions, where the power consumption is equivalent to “ACTIVE_PPC_OFF”. 5: Supply current for the ACTIVE and PD packet transmitting is in addition to the appropriate ACTIVE_P- PC_ON/OFF state’s typical value. |
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