82801E datasheet(3/84 Pages) INTEL

3 / 84 page

Advance Information Datasheet

Contents

1.0

Introduction....................................................................................................................................7

1.1

Overview ............................................................................................................................... 9

1.2

About this Document ..........................................................................................................10

2.0

Package Information ................................................................................................................... 11

2.1

Ball Location ....................................................................................................................... 11

2.2

Mechanical Specifications .................................................................................................. 23

3.0

Signal Descriptions ..................................................................................................................... 25

3.1

Alphabetical Signal Reference............................................................................................25

3.2

Signals Grouped By Type ................................................................................................... 36

3.2.1

Hub Interface to Host Controller ............................................................................ 36

3.2.2

Link to LAN Connect .............................................................................................. 36

3.2.3

EEPROM Interface ................................................................................................ 36

3.2.4

Firmware Hub Interface ......................................................................................... 37

3.2.5

PCI Interface .......................................................................................................... 37

3.2.6

IDE Interface .......................................................................................................... 40

3.2.7

LPC Interface ......................................................................................................... 41

3.2.8

Interrupt Interface .................................................................................................. 41

3.2.9

USB Interface ........................................................................................................42

3.2.10 Power Signals ........................................................................................................42

3.2.11 Processor Interface................................................................................................ 43

3.2.12 SMBus Interface .................................................................................................... 44

3.2.13 System Management Interface ..............................................................................44

3.2.14 Real Time Clock Interface .....................................................................................44

3.2.15 Other Clocks .......................................................................................................... 45

3.2.16 Universal Asynchronous Receive and Transmit (UART 0,1) .................................45

3.2.17 SIU LPC Interface .................................................................................................. 46

3.2.18 Miscellaneous Signals ........................................................................................... 47

3.2.19 General Purpose I/O .............................................................................................. 47

3.2.20 Power and Ground.................................................................................................48

3.3

Pin Straps ...........................................................................................................................49

3.3.1

Functional Straps ................................................................................................... 49

3.3.2

Test Signals ........................................................................................................... 49

3.3.2.1

Test Mode Selection ..............................................................................49

3.3.2.2

Test Straps............................................................................................. 50

3.3.3

External RTC Circuitry ........................................................................................... 50

3.3.4

V5REF/Vcc3_3 Sequencing Requirements ...........................................................51

3.4

Power Planes and Pin States ............................................................................................. 51

3.4.1

Power Planes......................................................................................................... 51

3.4.2

Integrated Pull-Ups and Pull-Downs ...................................................................... 52

3.4.3

IDE Integrated Series Termination Resistors......................................................... 52

3.4.4

Output and I/O Signals Planes and States ............................................................ 53

3.4.5

Power Planes for Input Signals..............................................................................55

4.0

Electrical Characteristics............................................................................................................ 57

4.1

Absolute Maximum Ratings ................................................................................................ 57

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