APA600 datasheet(41/178 Pages) ACTEL

41 / 178 page

ProASICPLUS Flash Family FPGAs

v5.9

2-31

Operating Conditions

Table 2-17 and Table 2-18 delineate operating limits.

Performance Retention

For devices operated and stored at 110°C or less, the

performance

retention

period

years

after

programming. For devices operated and stored at

temperatures greater than 110°C, refer to Table 2-19 on

page 2-32 to determine the performance retention

period. Actel does not guarantee performance if the

performance retention period is exceeded. Designers can

determine the performance retention period from the

following table.

Evaluate the percentage of time spent at the highest

temperature,

then

determine

the

highest

temperature to which the device will be exposed. In

Table 2-19 on page 2-32, find the temperature profile

that most closely matches the application.

Example – the ambient temperature of a system cycles

between 100°C (25% of the time) and 50°C (75% of the

time). No forced ventilation cooling system is in use. An

APA600-PQ208M

FPGA

operates

the

system,

dissipating

1 W.

The

package

thermal

resistance

(junction-to-ambient) in still air Θja is 20°C/W, indicating

that the junction temperature of the FPGA will be 120°C

(25% of the time) and 70°C (75% of the time). The entry

in Table 2-19 on page 2-32, which most closely matches

the application, is 25% at 125°C with 75% at 110°C.

Performance retention in this example is at least 16.0

years.

Note that exceeding the stated retention period may

result in a performance degradation in the FPGA below

the worst-case performance indicated in the Actel Timer.

To ensure that performance does not degrade below the

worst-case values in the Actel Timer, the FPGA must be

reprogrammed

within

the

performance

retention

period. In addition, note that performance retention is

independent of whether or not the FPGA is operating.

The retention period of a device in storage at a given

temperature will be the same as the retention period of

a device operating at that junction temperature.

Table 2-17 • Absolute Maximum Ratings*

Parameter

Condition

Minimum

Maximum

Units

Supply Voltage Core (VDD)–0.3

3.0

Supply Voltage I/O Ring (VDDP)–0.3

4.0

DC Input Voltage

–0.3

VDDP + 0.3

PCI DC Input Voltage

–1.0

VDDP + 1.0

PCI DC Input Clamp Current (absolute)

VIN < –1 or VIN = VDDP + 1 V

LVPECL Input Voltage

–0.3

VDDP + 0.5

GND

Note: *Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to

absolute maximum rated conditions for extended periods may affect device reliability. Devices should not be operated outside the

Recommended Operating Conditions.

Table 2-18 • Programming, Storage, and Operating Limits

Product Grade

Programming Cycles (min.)

Program Retention (min.)

Storage Temperature

Operating

Min.

Max.

TJ Max.

Junction

Temperature

Commercial

500

20 years

–55°C

110°C

Industrial

500

20 years

–55°C

110°C

Military

100

Refer to Table 2-19 on page 2-32

–65°C

150°C

MIL-STD-883

100

Refer to Table 2-19 on page 2-32

–65°C

150°C

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