APA600 datasheet(37/178 Pages) ACTEL

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ProASICPLUS Flash Family FPGAs

v5.9

2-27

Package Thermal Characteristics

The ProASICPLUS family is available in several package

types with a range of pin counts. Actel has selected

packages based on high pin count, reliability factors, and

superior thermal characteristics.

Thermal resistance defines the ability of a package to

conduct heat away from the silicon, through the

package to the surrounding air. Junction-to-ambient

thermal resistance is measured in degrees Celsius/Watt

and is represented as Theta ja

(Θja). The lower the

thermal resistance, the more efficiently a package will

dissipate heat.

A package’s maximum allowed power (P) is a function of

maximum junction temperature (TJ), maximum ambient

operating temperature (TA), and junction-to-ambient

thermal resistance Θja. Maximum junction temperature is

the maximum allowable temperature on the active

surface of the integrated circuit (IC) and is 110°C. P is

defined as shown in

EQ 2-4:

EQ 2-4

ja is a function of the rate (in linear feet per minute

(lfpm)) of airflow in contact with the package. When the

estimated power consumption exceeds the maximum

allowed power, other means of cooling, such as

increasing the airflow rate, must be used. The maximum

power dissipation allowed for a Military temperature

device is specified as a function of Θjc. The absolute

maximum junction temperature is 150°C.

The calculation of the absolute maximum power

dissipation

allowed

for

Military

temperature

application is illustrated in the following example for a

456-pin PBGA package:

EQ 2-5

–

-----------------

Table 2-16 • Package Thermal Characteristics

Plastic Packages

Pin Count

Units

Still Air

1.0 m/s

200 ft./min.

2.5 m/s

500 ft./min.

Thin Quad Flat Pack (TQFP)

100

14.0

33.5

27.4

25.0

°C/W

Thin Quad Flat Pack (TQFP)

144

11.0

33.5

28.0

25.7

°C/W

Plastic Quad Flat Pack (PQFP)1

208

8.0

26.1

22.5

20.8

°C/W

PQFP with heat spreader2

208

3.8

16.2

13.3

11.9

°C/W

Plastic Ball Grid Array (PBGA)

456

3.0

15.6

12.5

11.6

°C/W

Fine Pitch Ball Grid Array (FBGA)

144

3.8

26.9

22.9

21.5

°C/W

Fine Pitch Ball Grid Array (FBGA)

256

3.8

26.6

22.8

21.5

°C/W

Fine Pitch Ball Grid Array (FBGA)3

484

3.2

18.0

14.7

13.6

°C/W

Fine Pitch Ball Grid Array (FBGA)4

484

3.2

20.5

17.0

15.9

°C/W

Fine Pitch Ball Grid Array (FBGA)

676

3.2

16.4

13.0

12.0

°C/W

Fine Pitch Ball Grid Array (FBGA)

896

2.4

13.6

10.4

9.4

°C/W

Fine Pitch Ball Grid Array (FBGA)

1152

1.8

12.0

8.9

7.9

°C/W

Ceramic Quad Flat Pack (CQFP)

208

2.0

22.0

19.8

18.0

°C/W

Ceramic Quad Flat Pack (CQFP)

352

2.0

17.9

16.1

14.7

°C/W

Ceramic Column Grid Array (CCGA/LGA)

624

6.5

8.9

8.5

8.0

°C/W

Notes:

1. Valid for the following devices irrespective of temperature grade: APA075, APA150, and APA300

2. Valid for the following devices irrespective of temperature grade: APA450, APA600, APA750, and APA1000

3. Depopulated array

4. Full array

Maximum Power Allowed

Max. junction temp. (

°C) Max. case temp. (°C)

–

jc(°C/W)

-----------------------------------------------------------------------------------------------------------------------------

150

°C125°C

–

3.0

°C/W

----------------------------------------

8.333W

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