S25FS256S datasheet(53/154 Pages) SPANSION

53 / 154 page

November 6, 2013 S25FS-S_00_04

S25FS-S Family

Da ta

Shee t

(Prelim i nar y )

7.4.2

Physical Diagram

Figure 7.11 Ball Grid Array 24-Ball 6 x 8 mm (FAC024)

7.4.3

Special Handling Instructions for FBGA Packages

Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The

package and/or data integrity may be compromised if the package body is exposed to temperatures above

150°C for prolonged periods of time.

PACKAGE

FAC024

JEDEC

N/A

D x E

8.00 mm x 6.00 mm NOM

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

---

1.20

PROFILE

0.25

---

BALL HEIGHT

0.70

---

0.90

BODY THICKNESS

8.00 BSC.

BODY SIZE

6.00 BSC.

BODY SIZE

5.00 BSC.

MATRIX FOOTPRINT

3.00 BSC.

MATRIX FOOTPRINT

MATRIX SIZE D DIRECTION

MATRIX SIZE E DIRECTION

BALL COUNT

Øb

0.35

0.40

0.45

BALL DIAMETER

1.00 BSC.

BALL PITCHL

SD/ SE

0.5/0.5

SOLDER BALL PLACEMENT

DEPOPULATED SOLDER BALLS

PACKAGE OUTLINE TYPE

3642 F16-038.9 \ 09.10.09

NOTES:

DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

ALL DIMENSIONS ARE IN MILLIMETERS.

BALL POSITION DESIGNATION PER JEP95, SECTION

4.3, SPP-010.

e REPRESENTS THE SOLDER BALL GRID PITCH.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"

DIRECTION.

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS

FOR MATRIX SIZE MD X ME.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE

CROWNS OF THE SOLDER BALLS.

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A

AND B AND DEFINE THE POSITION OF THE CENTER SOLDER

BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE

OUTER ROW SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE

OUTER ROW, SD OR SE = e/2

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED

BALLS.

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.

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