IMX53CEC datasheet(19/204 Pages) FREESCALE

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Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

4.1.2.2

PoP Package Thermal Resistance

Table 6 provides the PoP package thermal resistance data.

3 Per JEDEC JESD51-6 with the board horizontal.

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2.

Table 6. PoP Package Thermal Resistance Data1

1 Calculated for just the i.MX53xD package, without the top mounted memory package.

Rating

Board

Symbol

designed

Center

Array of

Pillars

used for

Ground

Unit

Junction to Ambient (natural convection)2, 3

2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

3 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

Single layer board

(1s)

RθJA

°C/W

Junction to Ambient (natural convection)2, 3, 4

4 Per JEDEC JESD51-6 with the board horizontal.

Four layer board

(2s2p)

RθJA

°C/W

Junction to Ambient (at 200 ft/min)2, 4

Single layer board

(1s)

RθJMA

°C/W

Junction to Ambient (at 200 ft/min)2, 4

Four layer board

(2s2p)

RθJMA

°C/W

Junction to Board5

5 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

—RθJB

8.4

7.2

°C/W

Junction to Case6

6 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

—RθJC

<0.1

°C/W

Junction to Package Top (natural convection)7

7 Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

—

°C/W

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