IMX53CEC datasheet(18/204 Pages) FREESCALE

18 / 204 page

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

Electrical Characteristics

4.1.2

Thermal Resistance

4.1.2.1

TEPBGA-2 Package Thermal Resistance

Table 5 provides the TEPBGA-2 package thermal resistance data.

Table 4. Absolute Maximum Ratings

Parameter Description

Symbol

Min

Max

Unit

Peripheral Core Supply Voltage

VCC

–0.3

1.35

ARM Core Supply Voltage

VDDGP

–0.3

1.35

Supply Voltage UHVIO

Supplies denoted as I/O Supply

–0.5

3.6

Supply Voltage for non UHVIO

Supplies denoted as I/O Supply

–0.5

3.3

USB VBUS

VBUS

—

5.25

Input voltage on USB_OTG_DP, USB_OTG_DN,

USB_H1_DP, USB_H1_DN pins

USB_DP/USB_DN

–0.3

3.631

1 USB_DN and USB_DP can tolerate 5 V for up to 24 hours.

Input/Output Voltage Range

Vin/Vout

–0.5

OVDD +0.32

2 The term OVDD in this section refers to the associated supply rail of an input or output. The association is described in

Table 112 on page 154. The maximum range can be superseded by the DC tables.

ESD Damage Immunity:

Vesd

• Human Body Model (HBM)

• Charge Device Model (CDM)

—

2000

500

Storage Temperature Range

TSTORAGE

–40

150

Table 5. TEPBGA-2 Package Thermal Resistance Data

Rating

Board

Symbol

Value

Unit

Junction to Ambient (natural convection)1, 2

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

Single layer board

(1s)

RθJA

°C/W

Junction to Ambient (natural convection)1, 2, 3

Four layer board

(2s2p)

RθJA

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Single layer board

(1s)

RθJMA

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Four layer board

(2s2p)

RθJMA

°C/W

Junction to Board4

—RθJB

6°C/W

Junction to Case5

—RθJC

4°C/W

Junction to Package Top (natural convection)6

—

4°C/W

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