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MPC8315ECVRAGDA датащи(PDF) 20 Page - Freescale Semiconductor, Inc |
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MPC8315ECVRAGDA датащи(HTML) 20 Page - Freescale Semiconductor, Inc |
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20 / 112 page ![]() MPC8315E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 0 20 Freescale Semiconductor DDR and DDR2 SDRAM Table 14 provides the DDR capacitance when GVDD(typ) = 2.5 V. Table 15 provides the current draw characteristics for MVREF. 7.2 DDR and DDR2 SDRAM AC Electrical Characteristics This section provides the AC electrical characteristics for the DDR and DDR2 SDRAM interface. 7.2.1 DDR and DDR2 SDRAM Input AC Timing Specifications Table 16 lists the input AC timing specifications for the DDR2 SDRAM (GVDD(typ) = 1.8 V). Table 17 lists the input AC timing specifications for the DDR SDRAM when GVDD(typ)=2.5 V. Table 14. DDR SDRAM Capacitance for GVDD(typ) = 2.5 V Interface Parameter/Condition Symbol Min Max Unit Notes Input/output capacitance: DQ,DQS CIO 68 pF 1 Delta input/output capacitance: DQ, DQS CDIO —0.5 pF 1 Note: 1. This parameter is sampled. GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA =25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V. Table 15. Current Draw Characteristics for MVREF Parameter / Condition Symbol Min Max Unit Note Current draw for MVREF IMVREF — 500 μA1 Note: 1. The voltage regulator for MVREF must be able to supply up to 500 μA current. Table 16. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface At recommended operating conditions with GVDD of 1.8V ± 100 mV Parameter Symbol Min Max Unit Notes AC input low voltage VIL — MVREF – 0.45 V — AC input high voltage VIH MVREF + 0.45 — V — Table 17. DDR SDRAM Input AC Timing Specifications for 2.5 V Interface At recommended operating conditions with GVDD of 2.5V ± 200 mV Parameter Symbol Min Max Unit Notes AC input low voltage VIL — MVREF – 0.51 V AC input high voltage VIH MVREF + 0.51 — V |
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