поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

AD9522-5/PCBZ датащи(PDF) 54 Page - Analog Devices

номер детали AD9522-5/PCBZ
подробное описание детали  12 LVDS/24 CMOS Output Clock Generator
PDF  76 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

AD9522-5/PCBZ датащи(HTML) 54 Page - Analog Devices

Back Button AD9522-5/PCBZ Datasheet HTML 50Page - Analog Devices AD9522-5/PCBZ Datasheet HTML 51Page - Analog Devices AD9522-5/PCBZ Datasheet HTML 52Page - Analog Devices AD9522-5/PCBZ Datasheet HTML 53Page - Analog Devices AD9522-5/PCBZ Datasheet HTML 54Page - Analog Devices AD9522-5/PCBZ Datasheet HTML 55Page - Analog Devices AD9522-5/PCBZ Datasheet HTML 56Page - Analog Devices AD9522-5/PCBZ Datasheet HTML 57Page - Analog Devices AD9522-5/PCBZ Datasheet HTML 58Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 54 / 76 page
background image
AD9522-5
Rev. 0 | Page 54 of 76
THERMAL PERFORMANCE
Table 42. Thermal Parameters for the 64-Lead LFCSP
Symbol
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Value (°C/W)
θJA
Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)
22.0
θJMA
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
19.2
θJMA
Junction-to-ambient thermal resistance, 2.0 m/sec airflow per JEDEC JESD51-6 (moving air)
17.2
ΨJB
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
11.6
θJC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1
1.3
ΨJT
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
0.1
The AD9522 is specified for a case temperature (TCASE). To ensure
that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction
temperature on the application PCB:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the user at the
top center of the package.
ΨJT is the value from Table 42.
PD is the power dissipation (see the total power dissipation in
Table 15).
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of ΨJB are provided for package comparison and PCB
design considerations.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76


датащи скачать

Go To PDF Page


ссылки URL



Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   Ссылка на техническое описание    |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com