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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TAS2781RYYR датащи(PDF) 83 Page - Texas Instruments |
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TAS2781RYYR датащи(HTML) 83 Page - Texas Instruments |
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83 / 90 page  www.ti.com PACKAGE OUTLINE 3.6 3.4 4.1 3.9 1.0 0.8 0.05 0.00 2X 2.4 22X 0.4 2X 2 19X 0.5 0.3 26X 0.25 0.15 1.28 8X 0.425 0.95 2X 0.9 0.7 0.55 0.35 0.6 0.4 0.825 0.625 2X 0.9 0.7 8X 0.3 0.2 (0.09) TYP VQFN-HR - 1 mm max height RYY0030A PLASTIC QUAD FLATPACK - NO LEAD 4228222/B 05/2022 0.08 C 0.1 C A B 0.05 C 0.1 C A B 0.05 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID (45 X 0.15) SYMM SYMM 1 8 9 16 17 23 24 30 SCALE 3.000 A B C www.ti.com TAS2781 SLOSE86B – JULY 2022 – REVISED JULY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 83 Product Folder Links: TAS2781 |
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