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TAS2781RYYR датащи(PDF) 5 Page - Texas Instruments

номер детали TAS2781RYYR
подробное описание детали  TAS2781 24-V Class-D Amplifier with Real Time Integrated Speaker Protection and Audio Processing
PDF  90 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
Logo TI2 - Texas Instruments

TAS2781RYYR датащи(HTML) 5 Page - Texas Instruments

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6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
AVDD
Supply voltage
1.65
1.8
1.95
V
IOVDD
Supply voltage
3
3.3
3.6
V
1.65
1.8
1.95
NC_V1P8V
Supply voltage for ICC Pin
1.65
1.8
1.95
V
PVDDH(2)
Supply voltage
(functional)(1)
Min operating free-air and Min operating
junction temperature of -20°C
3
24
V
Min operating free-air and Min operating
junction temperature of -40°C
3
23
Supply voltage
(performance)
Min operating free-air and Min operating
junction temperature of -20°C
4.5
24
Min operating free-air and Min operating
junction temperature of -40°C
4.5
23
PVDDL
Supply voltage (functional)(1)
2.7
5.5
V
Supply voltage (performance with Y-bridge disabled)
3.5
5.5
Supply voltage (performance with Y-bridge enabled)
2.7
5.5
RSPK
Speaker impedance
3.2
Ω
LSPK
Speaker inductance
5
µH
(1)
Device will remain functional but performance may degrade.
(2)
PVDDH supply voltage should be greater than PVDDL-0.7 V.
6.4 Thermal Information
THERMAL METRIC(1)
UNIT
HR_QFN
30 PINS
RθJA
Junction-to-ambient thermal resistance
44.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
22.4
°C/W
RθJB
Junction-to-board thermal resistance
12.3
°C/W
ψJT
Junction-to-top characterization parameter
0.6
°C/W
ψJB
Junction-to-board characterization parameter
12.1
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
TA = 25 °C, PVDDH = 18 V, PVDDL= 3.8 V, AVDD = 1.8 V, IOVDD =1.8 V, RL = 4Ω + 15µH, fin = 1 kHz, fs = 48 kHz, Gain =
21 dBV, SDZ = 1, NG_EN=0, EN_LLSR=0, PWR_MODE1, Measured filter free as in Section 7 (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUT and OUTPUT
VIH
High-level digital input logic
voltage threshold
SBLK, FSYNC, SDIN, SCL_nSCS, SDA_SDI
0.7xIOVDD
V
VIL
Low-level digital input logic
voltage threshold
SBLK, FSYNC, SDIN, SCL_nSCS, SDA_SDI
0.3 x
IOVDD
V
VIH(SDZ)
High-level digital input logic
voltage threshold
SDZ
0.7xAVDD
V
www.ti.com
TAS2781
SLOSE86B – JULY 2022 – REVISED JULY 2023
Copyright © 2023 Texas Instruments Incorporated
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