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DM505LRBABF датащи(PDF) 102 Page - Texas Instruments

номер детали DM505LRBABF
подробное описание детали  DM505 SoC for Vision Analytics 15mm Package (ABF) Silicon Revision 2.0
PDF  295 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
Logo TI2 - Texas Instruments

DM505LRBABF датащи(HTML) 102 Page - Texas Instruments

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porz
vdds18v_ddr1, vdds18v_ddr2,
vdds18v_ddr3, vdds18v,
vdda_osc, vdda_per, vdda_ddr_dsp,
vdda_gmac_core, vdda_csi,
vdda_dac, vdda_adc
vdds_ddr1, vdds_ddr2, vdds_ddr3
vdd
vdd_dspeve
vddshv1, vddshv2, vddshv3,
vddshv4, vddshv5, vddshv6
xi_osc0
SPRS91 _ELCH_02
6
Note 6
Note 7
Note 9
Note 10
Note 11
DSPEVE voltage
CORE voltage
EMIF voltage
V1
T0
T1
T2
T3
T4
Note 4
Note 5
Note 8
Note 12
102
DM505
SPRS976E – NOVEMBER 2016 – REVISED MAY 2018
www.ti.com
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Specifications
Copyright © 2016–2018, Texas Instruments Incorporated
(7) If any of the vddshv[1-6] power rails are used for 1.8V I/O signaling, then these rails can be combined with vdds18v_*.
If 3.3V I/O signaling is required, then these rails must be the last to ramp following vdd_dspeve.
(8) resetn and porz must remain asserted low for a minimum of 12P(12) after xi_osc0 is stable at a valid frequency.
(9) Setup time: SYSBOOT[15:0] pins must be valid 2P(12) before porz is de-asserted high.
(10) Hold time: SYSBOOT[15:0] pins must be valid 15P(12) after porz is de-asserted high.
(11) resetn to rstoutn delay is 2ms.
(12) P = 1/(SYS_CLK1/610) frequency in ns.
(13) Ramped Up is defined as reaching the minimum operational voltage level for the corresponding power domain. For information about
voltage levels, refer to , Recommended Operating Conditions.
Figure 5-5. Recommended Power-Down Sequencing
(1) T1
≥ 100 µs; T2 = 500 µs; T3 = 1.0 ms; T4 = 1.5ms; V1 = 2.7 V. All "Tn" markers are intended to show total elapsed time, not interval
times.
(2) Terminology:
VOPR MIN = Minimum Operational Voltage level that ensures device functionality and specified performance in Section 5.4,
Recommended Operating Conditions.
VOFF = OFF Voltage level is defined to be less than 0.6 V where any current draw has no impact to POH.
Ramp Down = transition time from VOPR MIN to VOFF and is slew rate independent.
(3) General timing diagram items:
Grey shaded areas show valid transition times for supplies between VOPR MIN and VOFF.
Blue dashed lines are not valid windows but show alternate ramp possibilities based on the associated note.
Dashed vertical lines show approximate elapse times based upon TI recommended PMIC power-down sequencer circuit
performance.
(4) porz must be asserted low for 100 µs min to ensure SoC is set to a safe functional state before any voltage begins to ramp down.
(5) vddshv[1-6] domains supplied by 3.3 V:
must remain greater than 2.7 V to enable Dual Voltage GPIO selector circuit operation for 100 µs min after porz is asserted low.
must be in first group of supplies ramping down after porz has been asserted low for 100 µs min.
must not exceed vdds18v by more than 2 V during ramp down, see Figure 5-6, "vdds18v versus vddshv[1-6] Discharge
Relationship".
(6) vddshv[1-6] domains supplied by 1.8 V must ramp down concurrently with vdds18v and be sourced from common vdds18v supply.
(7) vdd_dspeve domain can ramp down before or concurrently with vdd.
(8) vdd must ramp down after or concurrently with vdd_dspeve.
(9) vdds_ddr[1-3] domains:
should ramp down after vdd begins ramping down.



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