DM505LRBABF datasheet(97/295 Pages) TI2

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DM505

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SPRS976E – NOVEMBER 2016 – REVISED MAY 2018

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Specifications

5.8

Thermal Characteristics

For reliability and operability concerns, the maximum junction temperature of the Device has to be at or

below the TJ value identified in , Recommended Operating Conditions.

A BCI compact thermal model for this Device is available and recommended for use when modeling

thermal performance in a system.

Therefore, it is recommended to perform thermal simulations at the system level with the worst case

device power consumption.

5.8.1

Package Thermal Characteristics

Table 5-14 provides the thermal resistance characteristics for the package used on this device.

NOTE

Power dissipation of 4.14 W and an ambient temperature of 65ºC is assumed for ABF

package.

Table 5-14. Thermal Resistance Characteristics

NO.

PARAMET

DESCRIPTION

°C/W(1)

AIR FLOW (m/s)(2)

RΘJC

Junction-to-case

1.41

N/A

RΘJB

Junction-to-board

5.96

N/A

RΘJA

Junction-to-free air

15.4

Junction-to-moving air

13.1

12.2

11.6

ΨJT

Junction-to-free air

0.94

Junction-to-package top

0.94

T10

0.94

T11

ΨJB

Junction-to-free air

5.12

T12

Junction-to-board

4.78

T13

4.63

T14

4.52

(1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

–

JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

–

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

–

JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

–

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

–

JESD51-9, Test Boards for Area Array Surface Mount Packages

(2) m/s = meters per second

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