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DM505LRBABF датащи(PDF) 95 Page - Texas Instruments

номер детали DM505LRBABF
подробное описание детали  DM505 SoC for Vision Analytics 15mm Package (ABF) Silicon Revision 2.0
PDF  295 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
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DM505LRBABF датащи(HTML) 95 Page - Texas Instruments

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SPRS976E – NOVEMBER 2016 – REVISED MAY 2018
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Specifications
Copyright © 2016–2018, Texas Instruments Incorporated
Table 5-11. LVCMOS CSI2 DC Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
NOM
MAX
UNIT
VCMRXDC
Differential input common-mode voltage(5)(6)
70
330
mV
ZID
Differential input impedance
80
100
125
Ω
(1) VITH is the voltage at which the receiver is required to detect a high state in the input signal.
(2) VITL is the voltage at which the receiver is required to detect a low state in the input signal. VITL is larger than the maximum single-ended
line high voltage during HS transmission. Therefore, both low-power (LP) receivers will detect low during HS signaling.
(3) To reduce noise sensitivity on the received signal, the LP receiver is required to incorporate a hysteresis, VHYST. VHYST is the difference
between the VITH threshold and the VITL threshold.
(4) VITL is the voltage at which the receiver is required to detect a low state in the input signal. Specification is relaxed for detecting 0 during
ultralow power (ULP) state. The LP receiver is not required to detect HS single-ended voltage as 0 in this state.
(5) Excluding possible additional RF interference of 200 mVPP beyond 450 MHz.
(6) This value includes a ground difference of 50 mV between the transmitter and the receiver, the static common-mode level tolerance and
variations below 450 MHz.
(7) This number corresponds to the VODMAX transmitter.
(8) Common mode is defined as the average voltage level of X and Y: VCMRX = (VX + VY) / 2.
(9) Common mode ripple may be due to tR or tF and transmission line impairments in the PCB.
(10) For more information regarding the pin name (or ball name) and corresponding signal name, see Table 4-8 CSI 2 Signal Descriptions.
Table 5-12. Dual Voltage LVCMOS DC Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
DESCRIPTION
MIN
NOM
MAX
UNIT
1.8-V Mode
VIH
Input high-level threshold
0.65×VDDS
V
VIL
Input low-level threshold
0.35×VDDS
V
VHYS
Input hysteresis voltage
100
mV
VOH
Output high-level threshold (IOH = 2 mA)
VDDS-0.45
V
VOL
Output low-level threshold (IOL = 2 mA)
0.45
V
IDRIVE
Pin Drive strength at PAD Voltage = 0.45V or VDDS-
0.45V
6
mA
IIN
Input current at each I/O pin
16
µA
IOZ
IOZ(IPAD Current) at each IO pin. PAD is swept from 0
to VDDS and the Max(I(PAD)) is measured and is
reported as IOZ
11.5
µA
IIN with pulldown enabled
Input current at each I/O pin with weak pulldown
enabled measured when PAD = VDDS
60
120
200
µA
IIN with pullup enabled
Input current at each I/O pin with weak pullup enabled
measured when PAD = 0
60
120
210
µA
CPAD
Pad capacitance (including package capacitance)
4
pF
ZO
Output impedance (drive strength)
40
Ω
3.3-V Mode
VIH
Input high-level threshold
2
V
VIL
Input low-level threshold
0.8
V
VHYS
Input hysteresis voltage
200
mV
VOH
Output high-level threshold (IOH =100µA)
VDDS-0.2
V
VOL
Output low-level threshold (IOL = 100µA)
0.2
V
IDRIVE
Pin Drive strength at PAD Voltage = 0.45V or VDDS-
0.45V
6
mA
IIN
Input current at each I/O pin
64
µA
IOZ
IOZ(IPAD Current) at each IO pin. PAD is swept from 0
to VDDS and the Max(I(PAD)) is measured and is
reported as IOZ
64
µA



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