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STM32H533CE датащи(PDF) 203 Page - STMicroelectronics

номер детали STM32H533CE
подробное описание детали  Arm® Cortex®-M33 32-bit MCUTrustZone® FPU, 375 DMIPS 250 MHz, 512-Kbyte flash, 272-Kbyte RAM, cryptography
PDF  231 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32H533CE датащи(HTML) 203 Page - STMicroelectronics

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DS14539 Rev 1
203/231
STM32H533xx
Package information
227
Table 120. WLCSP39 - Mechanical data
Symbol
Millimeters
Inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min
Typ
Max
Min
Typ
Max
A(2)
2. The profile height, A, is the distance from the seating plane to the highest point on the package. It is
measured perpendicular to the seating plane.
-
-
0.58
-
-
0.0228
A1(3)
3. A1 is defined as the distance from the seating plane to the lowest point on the package body.
-
0.17
-
-
0.0067
-
A2
-
0.38
-
-
0.0150
-
A3
-
0.025
-
-
0.0010
-
b(4)
4. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to datum C.
0.23
0.26
0.28
0.0091
0.0102
0.0110
D2.76 BSC(5)
5. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance.
0.1087 BSC
D1
2.000 BSC
0.0787 BSC
E
2.78 BSC
0.1094 BSC
E1
2.078 BSC
0.0818 BSC
e(6)
6. e represents the solder balls grid pitch(es).
0.40 BSC
0.0157 BSC
SD(7)
7. Basic dimensions SD and SE are defining the ball matrix position with respect to datums A and B.
0.200 BSC
0.0079 BSC
SE(7)
0.346 BSC
0.0136 BSC
N39(8)
8. N represents the total number of balls.
aaa(9)
9. The tolerance of position that controls the location of the balls within the matrix with respect to each other.
0.02 BSC
0.0008 BSC
bbb(9)
0.06 BSC
0.0024 BSC
ccc(9)
0.03 BSC
0.0012 BSC
ddd(9)
0.015 BSC
0.0006 BSC
eee(9)
0.05 BSC
0.0020 BSC



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