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STM32H533CE датащи(PDF) 202 Page - STMicroelectronics |
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STM32H533CE датащи(HTML) 202 Page - STMicroelectronics |
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202 / 231 page ![]() Package information STM32H533xx 202/231 DS14539 Rev 1 6.2 WLCSP39 package information (B0MM) This WLCSP is a 39-ball, 2.76 x 2.78 mm, 0.4 mm pitch, wafer level chip scale array package. Figure 60. WLCSP39 - Outline 1. Drawing is not to scale. 2. The A1 corner must be identified on the top surface of the package by using a marking or a physical feature. A distinguish feature is allowable on the bottom surface of the package to identify the A1 corner. Exact shape of each corner is optional. B0MM_WLCSP39_ME_V1 E D1 D E1 SE SD e BOTTOM VIEW E D TOP VIEW (Datum B) (Datum A) A1 ball pad corner A1 ball pad corner Øb (39 balls) ddd C A B eee Ø Ø M M C A B C D E G F (Datum A) (Datum B) 11 10 9 8 7 6 5 4 3 2 1 aaa (4X) c A A3 A2 C A1 A Seating plane SIDE VIEW 1 2 3 4 5 6 7 8 9 10 11 A B C D E G F Back side coating Silicon Solder balls |
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