SPC563M60L7 datasheet(73/128 Pages) STMICROELECTRONICS

73 / 128 page

DocID14642 Rev 12

73/128

SPC563M64x, SPC563M60x

Electrical characteristics

127

where:

= thermocouple temperature on top of the package (oC)



= thermal characterization parameter (oC/W)

= power dissipation in the package (W)

The thermal characterization parameter is measured in compliance with the JESD51-2

specification using a 40-gauge type T thermocouple epoxied to the top center of the

package case. Position the thermocouple so that the thermocouple junction rests on the

package. Place a small amount of epoxy on the thermocouple junction and approximately 1

mm of wire extending from the junction. Place the thermocouple wire flat against the

package case to avoid measurement errors caused by the cooling effects of the

thermocouple wire.

References:

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134

USA

(408) 943-6900

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering

Documents at 800-854-7179 or 303-397-7956.

JEDEC specifications are available on the jedec.org web site.



C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an

Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998,

pp. 47-54.



G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled

Applications”, Electronic Packaging and Production, pp. 53-58, March 1998.



B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal

Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San

Diego, 1999, pp. 212-220.

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