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IMX7DCEC датащи(PDF) 53 Page - NXP Semiconductors |
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IMX7DCEC датащи(HTML) 53 Page - NXP Semiconductors |
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53 / 161 page ![]() Electrical characteristics i.MX 7Dual Family of Applications Processors Datasheet, Rev. 7, 09/2023 NXP Semiconductors 53 Table 40 shows DDR I/O output buffer impedance of i.MX 7Dual family of processors. Note: 1. Output driver impedance is controlled across PVTs using ZQ calibration procedure. 2. Calibration is done against 240 external reference resistor. 3. Output driver impedance deviation (calibration accuracy) is ±5% (max/min impedance) across PVTs. 4.7.2 Differential I/O output buffer impedance The Differential CCM interface is designed to be compatible with TIA/EIA 644-A standard. See, TIA/EIA STANDARD 644-A, Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits (2001) for details. 4.7.3 USB battery charger detection driver impedance The USB_OTG1_CHD_B open-drain output pin can be used to signal the results of USB Battery Charger detection routines for the USB_OTG1 PHY instance to power management and monitoring devices. Use of this pin requires an external pullup resistor, for more information see Table 3, and Table 7. Table 41 shows the USB_OTG1_CHD_B pulldown driver impedance for the USB_OTG1_CHD_B pin. 4.8 System modules timing This section contains the timing and electrical parameters for the modules in each i.MX 7Dual processor. Table 40. DDR I/O output buffer impedance Parameter Symbol Test Conditions DSE (Drive Strength) Typical Unit NVCC_DRAM=1.5 V (DDR3) DDR_SEL=11 NVCC_DRAM=1.2 V (LPDDR2) DDR_SEL=10 Output Driver Impedance Rdrv 000 001 010 011 100 101 110 111 Hi-Z 240 120 80 60 48 40 34 Hi-Z 240 120 80 60 48 40 34 Table 41. USB_OTG1_CHD_B pulldown driver impedance (VDD_USB_OTG1_3P3_IN 3.3 V) Parameter Symbol Typical Unit Open-drain output driver pulldown impedance Rdrv_pd 1000 |
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