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IMX7DCEC датащи(PDF) 23 Page - NXP Semiconductors |
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IMX7DCEC датащи(HTML) 23 Page - NXP Semiconductors |
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23 / 161 page ![]() Electrical characteristics i.MX 7Dual Family of Applications Processors Datasheet, Rev. 7, 09/2023 NXP Semiconductors 23 4.1.3 Operating ranges Table 9 provides the operating ranges of the i.MX 7Dual family of processors. For details on the chip's power structure, see the “Power Management Unit (PMU)” chapter of the i.MX 7Dual Application Processor Reference Manual (IMX7DRM). 5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. Table 9. Operating ranges Parameter Description Symbol Min Typ Max1 Unit Comment Run Mode VDD_ARM 0.95 1.0 1.25 V Operation at 800 MHz and below 1.045 1.1 1.25 V Operation between 800 MHz and 1 GHz 1.2 1.225 1.25 V Operation between 1.0 GHz and 1.2 GHz. See Table 1 for maximum frequencies. VDD_SOC 0.95 1.0 1.25 V — Standby/ Deep Sleep mode VDD_ARM 0 1.0 1.25 V See Table 14, “Power modes,” on page 29. VDD_SOC 0.95 1.0 1.155 V Power Supply Analog Domain and LDOs VDDA_1P8 1.71 1.8 1.89 V Power for analog LDO and internal analog blocks. Must match the range of voltages that the rechargeable backup battery supports. Backup battery supply range VDD_SNVS_IN 2.4 3.0 3.6 V — LDO for Low-Power State Retention mode VDD_LPSR 1.71 1.8 1.89 V Power rail for Low Power State Retention mode Supply for 24 MHz crystal VDD_XTAL_1P8 1.650 1.8 1.950 V — Temperature sensor VDD_TEMPSENSOR 1.710 1.8 1.890 V — USB supply voltages VDD_USB_OTG1_3 P3_IN 3.0 3.3 3.6 V This rail is for USB VDD_USB_OTG2_3 P3_IN 3.0 3.3 3.6 V This rail is for USB |
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