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NAND04GA3C2A датащи(PDF) 38 Page - STMicroelectronics |
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NAND04GA3C2A датащи(HTML) 38 Page - STMicroelectronics |
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38 / 51 page ![]() 12 DC and AC parameters NAND04GA3C2A, NAND04GW3C2A 38/51 Table 20. AC Characteristics for Operations, VDDQ 3V Devices (1) Symbol Alt. Symbol Parameter 3V I/O Unit tALLRL1 tAR Address Latch Low to Read Enable Low Read Electronic Signature Min 20 ns tALLRL2 Read cycle Min 20 ns tBHRL tRR Ready/Busy High to Read Enable Low Min 20 ns tBLBH1 Ready/Busy Low to Ready/Busy High Read Busy time Max 60 µs tBLBH2 tPROG Program Busy time Max 2000 µs tBLBH3 tBERS Erase Busy time Max 3 ms tBLBH4 Reset Busy time, during ready Max 5 µs tWHBH1 tRST Write Enable High to Ready/Busy High Reset Busy time, during read Max 20 µs Reset Busy time, during program Max 40 µs Reset Busy time, during erase Max 200 µs tCLLRL tCLR Command Latch Low to Read Enable Low Min 15 ns tDZRL tIR Data Hi-Z to Read Enable Low Min 0 ns tEHQZ tCHZ Chip Enable High to Output Hi-Z Max 30 ns tELQV tCEA Chip Enable Low to Output Valid Max 50 ns tRHRL tREH Read Enable High to Read Enable Low Read Enable High Hold time Min 20 ns tRHQZ tRHZ Read Enable High to Output Hi-Z Max 30 ns tRLRH tRP Read Enable Low to Read Enable High Read Enable Pulse Width Min 40 ns tRLRL tRC Read Enable Low to Read Enable Low Read Cycle time Min 60 ns tRLQV tREA Read Enable Low to Output Valid Read Enable Access time Max 45 ns Read ES Access time(2) tWHBH tR Write Enable High to Ready/Busy High Read Busy time Max 60 µs tWHBL tWB Write Enable High to Ready/Busy Low Max 100 ns tWHRL tWHR Write Enable High to Read Enable Low Min 80 ns tVHWH (3) tWW Write Protection time Min 100 ns tVLWH (3) Min 100 ns 1. AC Characteristics for VDDQ 1.8V devices are still to be determined. 2. ES = Electronic Signature. 3. WP High to W High during Program/Erase Enable operations. |
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