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NAND04GA3C2A датащи(PDF) 11 Page - STMicroelectronics

номер детали NAND04GA3C2A
подробное описание детали  4Gbit, 2112 Byte Page, 3V, Multi-level NAND Flash Memory
PDF  51 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

NAND04GA3C2A датащи(HTML) 11 Page - STMicroelectronics

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NAND04GA3C2A, NAND04GW3C2A
2 Memory array organization
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2
Memory array organization
The memory array is made up of NAND structures where 32 cells are connected in series.
The memory array is organized in blocks where each block contains 128 pages. The array is
split into two areas, the main area and the spare area. The main area of the array is used to
store data whereas the spare area is typically used to store software flags or Bad Block
identification.
The pages are split into a 2048 Byte main area and a spare area of 64 Bytes.Refer to
Figure 4: Memory Array Organization.
2.1
Bad blocks
The NAND04GA3C2A and NAND04GW3C2A devices may contain Bad Blocks, that is
blocks that contain one or more invalid bits whose reliability is not guaranteed. Additional
Bad Blocks may develop during the lifetime of the device.
The Bad Block Information is written prior to shipping (refer to Section 9.1: Bad block
management for more details).
Table 4: Valid Blocks shows the minimum number of valid blocks in each device. The values
shown include both the Bad Blocks that are present when the device is shipped and the Bad
Blocks that could develop later on.
These blocks need to be managed using Bad Blocks Management and Block Replacement
(refer to Section 9: Software algorithms).
Table 4.
Valid Blocks
Density of Device
Min
Max
4 Gbits
2008
2048



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