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MPC885ZP80 датащи(PDF) 11 Page - NXP Semiconductors

номер детали MPC885ZP80
подробное описание детали  MPC885/MPC880 PowerQUICC Hardware Specifications
PDF  87 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
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MPC885ZP80 датащи(HTML) 11 Page - NXP Semiconductors

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MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7
Freescale Semiconductor
11
Power Dissipation
5
Power Dissipation
Table 5 provides information on power dissipation. The modes are 1:1, where CPU and bus speeds are
equal, and 2:1, where CPU frequency is twice bus speed.
NOTE
The values in Table 5 represent VDDL-based power dissipation and do not
include I/O power dissipation over VDDH. I/O power dissipation varies
widely by application due to buffer current, depending on external circuitry.
The VDDSYN power dissipation is negligible.
6
DC Characteristics
Table 6 provides the DC electrical characteristics for the MPC885/MPC880.
Table 5. Power Dissipation (PD)
Die Revision
Bus Mode
CPU
Frequency
Typical1
1 Typical power dissipation at V
DDL = VDDSYN = 1.8 V, and VDDH is at 3.3 V.
Maximum2
2 Maximum power dissipation at V
DDL = VDDSYN = 1.9 V, and VDDH is at 3.5 V.
Unit
0
1:1
66 MHz
310
390
mW
80 MHz
350
430
mW
2:1
133 MHz
430
495
mW
Table 6. DC Electrical Specifications
Characteristic
Symbol
Min
Max
Unit
Operating voltage
VDDL (core)
1.7
1.9
V
VDDH (I/O)
3.135
3.465
V
VDDSYN
1
1.7
1.9
V
Difference
between VDDL
and VDDSYN
—100
mV
Input high voltage (all inputs except EXTAL and EXTCLK)2
VIH
2.0
3.465
V
Input low voltage3
VIL
GND
0.8
V
EXTAL, EXTCLK input high voltage
VIHC
0.7*(VDDH)VDDH
V
Input leakage current, Vin = 5.5 V (except TMS, TRST, DSCK and DSDI
pins) for 5-V tolerant pins 2
Iin
—
100
µA
Input leakage current, Vin = VDDH (except TMS, TRST, DSCK, and DSDI)
IIn
—10
µA
Input leakage current, Vin = 0 V (except TMS, TRST, DSCK and DSDI
pins)
IIn
—10
µA
Input capacitance4
Cin
—20
pF



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