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MPC7450EC датащи(PDF) 30 Page - Motorola, Inc |
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MPC7450EC датащи(HTML) 30 Page - Motorola, Inc |
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30 / 52 page ![]() 30 MPC7450 RISC Microprocessor Hardware Specifications MOTOROLA Pin Assignments 1.6 Pin Assignments Figure 18 (in Part A) shows the pinout of the MPC7450, 483 CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top surface view. Part A Figure 18. Pinout of the MPC7450, 483 CBGA Package as Viewed from the Top Surface A B C D E F G H J K L M N P R T 1 2 3 4 5 6 7 8 9 1011 12 1314 15 16 Not to Scale 17 18 19 U V W 20 21 22 Y AA AB View Part B Die Substrate Assembly Encapsulant Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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