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MPC7450EC датащи(PDF) 12 Page - Motorola, Inc |
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MPC7450EC датащи(HTML) 12 Page - Motorola, Inc |
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12 / 52 page ![]() 12 MPC7450 RISC Microprocessor Hardware Specifications MOTOROLA Electrical and Thermal Characteristics Table 4 provides the recommended operating conditions for the MPC7450. Table 5 provides the package thermal characteristics for the MPC7450. Table 4. Recommended1 Operating Conditions Characteristic Symbol Recommended Value Unit Notes Min Max Core supply voltage VDD 1.55 1.85 V 3 PLL supply voltage AVDD 1.55 1.85 V 2, 3 Processor bus supply voltage BVSEL = 0 OVDD 1.8 V ± 5% V BVSEL = HRESET or OVDD OVDD 2.5 V ± 5% V L3 bus supply voltage L3VSEL = 0 GVDD 1.8 V ± 5% V L3VSEL = HRESET or GVDD GVDD 2.5 V ± 5% V L3VSEL = ¬HRESET GVDD 1.5 V ± 5% V Input voltage Processor bus Vin GND OVDD V L3 bus Vin GND GVDD V JTAG signals Vin GND OVDD V Die-junction temperature Tj 0 105 °C Notes: 1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed. 2. This voltage is the input to the filter discussed in Section 1.9.2, “PLL Power Supply Filtering” and not necessarily the voltage at the AVDD pin which may be reduced from VDD by the filter. 3. 1.6 V nominal. Operation at core voltages up to 1.8 V is supported, but the power consumption given in Table 7 must be adjusted correspondingly by the formula: P = C V 2 f, where P is the power consumption, C is a constant, V is the core voltage, and f is the core frequency. Table 5. Package Thermal Characteristics Characteristic Symbol Value Rating CBGA package thermal resistance, junction-to-case thermal resistance (typical) θ JC <0.1 °C/W CBGA package thermal resistance, die junction-to-lead thermal resistance (typical) θ JB 2.2 °C/W Note: Refer to Section 1.9, “System Design Information,” for more details about thermal management. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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