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MPC7450EC датащи(PDF) 46 Page - Motorola, Inc |
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MPC7450EC датащи(HTML) 46 Page - Motorola, Inc |
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46 / 52 page ![]() 46 MPC7450 RISC Microprocessor Hardware Specifications MOTOROLA System Design Information graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure. As shown, the performance of these thermal interface materials improves with increasing contact pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare joint results in a thermal resistance approximately 7 times greater than the thermal grease joint. Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see Figure 24). Therefore, the synthetic grease offers the best thermal performance, considering the low interface pressure and is recommended due to the high power dissipation of the MPC7450. Of course, the selection of any thermal interface material depends on many factors—thermal performance requirements, manufacturability, service temperature, dielectric properties, cost, etc. Figure 26. Thermal Performance of Select Thermal Interface Material The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment shock/vibration requirements. There are several commercially available thermal interfaces and adhesive materials provided by the following vendors: Dow-Corning Corporation 800-248-2481 Dow-Corning Electronic Materials PO Box 0997 Midland, MI 48686-0997 Internet: www.dow.com Chomerics, Inc. 781-935-4850 77 Dragon Court Woburn, MA 01888-4014 Internet: www.chomerics.com 0 0.5 1 1.5 2 0 1020304050607080 Silicone Sheet (0.006 inch) Bare Joint Floroether Oil Sheet (0.007 inch) Graphite/Oil Sheet (0.005 inch) Synthetic Grease Contact Pressure (psi) Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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