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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC7450EC датащи(PDF) 23 Page - Motorola, Inc |
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MPC7450EC датащи(HTML) 23 Page - Motorola, Inc |
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23 / 52 page  MOTOROLA MPC7450 RISC Microprocessor Hardware Specifications 23 Electrical and Thermal Characteristics Figure 9 shows the typical connection diagram for the MPC7450 interfaced to MSUG2 SRAMs such as the Motorola MCM64E836. Figure 9. Typical Source Synchronous 2-Mbyte L3 Cache DDR Interface {L3DATA[0:15], {L3DATA[16:31], {L3_DATA[32:47], L3ADDR[0:17] L3_CNTL[0] L3_CLK[0] L3_CLK[1] L3_ECHO_CLK[0] L3_ECHO_CLK[1] L3ECHO_CLK[2] L3_ECHO_CLK[3] {L3DATA[48:63], L3DP[0:1]} L3DP[2:3]} L3DP[4:5]} L3DP[6:7]} CQ SA[0:17] CK B1 B2 SRAM 0 SRAM 1 CQ D[0:17] D[18:35] CQ SA[0:17] CK B1 B2 CQ D[0:17] D[18:35] L3_CNTL[1] NC NC GND GND GND NC NC GND GND GND MPC7450 Denotes Receive (SRAM to MPC7450) Aligned Signals Denotes Transmit (MPC7450 to SRAM) Aligned Signals GVDD/2 GVDD/2 CQ CK B3 G CQ LBO CQ CK B3 G CQ LBO Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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