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SPC56EL70L3 датащи(PDF) 81 Page - STMicroelectronics |
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SPC56EL70L3 датащи(HTML) 81 Page - STMicroelectronics |
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81 / 128 page ![]() DocID023953 Rev 5 81/128 SPC56EL70L3, SPC56EL70L5,PC564L70L3, SPC564L70L5 Electrical characteristics 127 3.5.1.1 References Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134 USA (408) 943-6900 MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or 303-397-7956. JEDEC specifications are available on the WEB in JEDEC site. 1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54. 2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications,” Electronic Packaging and Production, pp. 53–58, March 1998. 3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220. 3.6 Electromagnetic Interference (EMI) characteristics The characteristics in Table 14 were measured using: Device configuration, test conditions, and EM testing per standard IEC61967-2 Supply voltage of 3.3 V DC Ambient temperature of 25 C The configuration information referenced in Table 14 is explained in Table 13. Table 13. EMI configuration summary Configuration name Description Configuration A – High emission = all pads have max slew rate, LVDS pads running at 40 MHz – Oscillator frequency = 40 MHz – System bus frequency = 120 MHz – No PLL frequency modulation – IEC level K ( 30 dBV) Configuration B – Reference emission = pads use min, mid and max slew rates, LVDS pads disabled – Oscillator frequency = 40 MHz – System bus frequency = 120 MHz – 2% PLL frequency modulation – IEC level K( 30 dBV) |
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