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MCP39F521 датащи(PDF) 45 Page - Microchip Technology

номер детали MCP39F521
подробное описание детали  I2C Power Monitor with Calculation and Energy Accumulation
PDF  52 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP39F521 датащи(HTML) 45 Page - Microchip Technology

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 2015 Microchip Technology Inc.
DS20005442A-page 45
MCP39F521
Microchip Technology Drawing C04-140C Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN]
Dimension Limits
Units
D
Overall Width
Overall Length
Exposed Pad Length
Exposed Pad Width
Contact Thickness
D2
E2
E
3.35
MILLIMETERS
0.20 REF
MIN
A3
MAX
5.00 BSC
3.25
Contact Length
Contact Width
L
b
0.45
0.30
Notes:
1.
K
Contact-to-Exposed Pad
0.20
NOM
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
3.
2.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Standoff
A1
0.02
Overall Height
A
0.90
Pitch
e
0.50 BSC
Number of Pins
N28
0.35
0.18
3.15
3.15
0.00
0.80
0.25
0.40
-
3.25
5.00 BSC
3.35
0.05
1.00
-
Pin 1 visual index feature may vary, but must be located within the hatched area.
Dimensioning and tolerancing per ASME Y14.5M.
Package is saw singulated.



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