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PRIXP425BD датащи(PDF) 42 Page - Intel Corporation |
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PRIXP425BD датащи(HTML) 42 Page - Intel Corporation |
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42 / 112 page ![]() Intel® IXP42X Product Line and IXC1100 Control Plane Processor Package and Pinout Information 42 Datasheet 4.0 Package and Pinout Information The Intel® IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor have a 492-ball, plastic ball grid array (PBGA) package for commercial-temperature applications and a pin-for-pin, compatible 492-ball, plastic ball grid array with a drop-in heat spreader (H) for extended-temperature applications. 4.1 Package Description Figure 6. 492-Pin Lead PBGA Package 1. All measurements are in millimeters (mm). 2. The size of the land pad at the interposer side (1) is 0.81 mm. 3. The size of the solder resist at the interposer side (2) is 0.66 mm. B1268-03 0.60 ± 0.10 Seating Plane 30º 3 1.17 ± 0.05 2.38 ± 0.21 0.61 ± 0.06 0.15 C 0.20 -C- SIDE VIEW 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 A B C D E F G H J K L M N P R AA Y W U T 23 22 21 20 19 18 17 16 24 25 26 V AB AC AD AE AF Pin #1 Corner 1.27 1.63 REF 1.27 A C ø 0.30 B S ø1.0 3 Places 2 + + 1.63 REF 0.90 0.60 ø S S + + + 22.00 REF 22.00 REF 35.00 ± 0.20 35.00 ± 0.20 30.00 ± 0.25 Pin 1 ID 30.00 ± 0.25 45º Chamfer 4 Places 0.127 A -B- -A- TOP VIEW (1) (2) |
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