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A3P030 датащи(PDF) 77 Page - Microsemi Corporation |
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A3P030 датащи(HTML) 77 Page - Microsemi Corporation |
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77 / 220 page ![]() ProASIC3 Flash Family FPGAs Revision 13 2-63 3.3 V PCI, 3.3 V PCI-X Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI Bus applications. AC loadings are defined per the PCI/PCI-X specifications for the datapath; Microsemi loadings for enable path characterization are described in Figure 2-10. AC loadings are defined per PCI/PCI-X specifications for the datapath; Microsemi loading for tristate is described in Table 2-87. Table 2-85 • 1.5 V LVCMOS Low Slew Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Standard I/O Banks Drive Strength Speed Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units 2 mA Std. 0.66 12.33 0.04 1.42 0.43 11.79 12.33 2.45 2.32 ns –1 0.56 10.49 0.04 1.21 0.36 10.03 10.49 2.08 1.98 ns –2 0.49 9.21 0.03 1.06 0.32 8.81 9.21 1.83 1.73 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-86 • Minimum and Maximum DC Input and Output Levels 3.3 V PCI/PCI-X VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH Drive Strength Min. V Max. V Min. V Max. V Max,. V Min. VmA mA Max. mA1 Max. mA1 µA2 µA2 Per PCI specification Per PCI curves 10 10 Notes: 1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage. 2. Currents are measured at 85°C junction temperature. Figure 2-10 • AC Loading Test Point Enable Path R to VCCI for tLZ / tZL / tZLS 10 pF for tZH / tZHS / tZL / tZLS 5 pF for tHZ / tLZ R to GND for tHZ / tZH / tZHS R = 1 k Test Point Datapath R = 25 R to VCCI for tDP (F) R to GND for tDP (R) Table 2-87 • AC Waveforms, Measuring Points, and Capacitive Loads Input Low (V) Input High (V) Measuring Point* (V) CLOAD (pF) 0 3.3 0.285 * VCCI for tDP(R) 0.615 * VCCI for tDP(F) 10 Note: *Measuring point = Vtrip. See Table 2-22 on page 2-21 for a complete table of trip points. |
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