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A3P030 датащи(PDF) 22 Page - Microsemi Corporation

номер детали A3P030
подробное описание детали  ProASIC3 Flash Family FPGAs with Optional Soft ARM Support
PDF  220 Pages
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производитель  MICROSEMI [Microsemi Corporation]
домашняя страница  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

A3P030 датащи(HTML) 22 Page - Microsemi Corporation

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ProASIC3 DC and Switching Characteristics
2-8
Revision 13
Table 2-11 • Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings1
Applicable to Advanced I/O Banks
CLOAD (pF)
VCCI (V)
Static Power
PDC3 (mW)2
Dynamic Power
PAC10 (µW/MHz)3
Single-Ended
3.3 V LVTTL / 3.3 V LVCMOS
35
3.3
468.67
3.3 V LVCMOS Wide Range4
35
3.3
468.67
2.5 V LVCMOS
35
2.5
267.48
1.8 V LVCMOS
35
1.8
149.46
1.5 V LVCMOS
(JESD8-11)
35
1.5
103.12
3.3 V PCI
10
3.3
201.02
3.3 V PCI-X
10
3.3
201.02
Differential
LVDS
2.5
7.74
88.92
LVPECL
3.3
19.54
166.52
Notes:
1. Dynamic power consumption is given for standard load and software default drive strength and output slew.
2. PDC3 is the static power (where applicable) measured on VCCI.
3. PAC10 is the total dynamic power measured on VCC and VCCI.
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
Table 2-12 • Summary of I/O Output Buffer Power (Per Pin) – Default I/O Software Settings1
Applicable to Standard Plus I/O Banks
CLOAD (pF)
VCCI (V)
Static Power
PDC3 (mW)2
Dynamic Power
PAC10 (µW/MHz)3
Single-Ended
3.3 V LVTTL / 3.3 V LVCMOS
35
3.3
452.67
3.3 V LVCMOS Wide Range4
35
3.3
452.67
2.5 V LVCMOS
35
2.5
258.32
1.8 V LVCMOS
35
1.8
133.59
1.5 V LVCMOS (JESD8-11)
35
1.5
92.84
3.3 V PCI
10
3.3
184.92
3.3 V PCI-X
10
3.3
184.92
Notes:
1. Dynamic power consumption is given for standard load and software default drive strength and output slew.
2. PDC3 is the static power (where applicable) measured on VMV.
3. PAC10 is the total dynamic power measured on VCC and VMV.
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.



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