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A3P030 датащи(PDF) 24 Page - Microsemi Corporation

номер детали A3P030
подробное описание детали  ProASIC3 Flash Family FPGAs with Optional Soft ARM Support
PDF  220 Pages
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производитель  MICROSEMI [Microsemi Corporation]
домашняя страница  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

A3P030 датащи(HTML) 24 Page - Microsemi Corporation

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ProASIC3 DC and Switching Characteristics
2-10
Revision 13
Power Consumption of Various Internal Resources
Table 2-14 • Different Components Contributing to Dynamic Power Consumption in ProASIC3 Devices
Parameter
Definition
Device Specific Dynamic Contributions
(µW/MHz)
PAC1
Clock contribution of a Global Rib
14.50 12.80 12.80 11.00 11.00 9.30 9.30 9.30
PAC2
Clock contribution of a Global Spine
2.48
1.85
1.35
1.58
0.81
0.81 0.41 0.41
PAC3
Clock contribution of a VersaTile row
0.81
PAC4
Clock contribution of a VersaTile used as a
sequential module
0.12
PAC5
First contribution of a VersaTile used as a
sequential module
0.07
PAC6
Second contribution of a VersaTile used as a
sequential module
0.29
PAC7
Contribution of a VersaTile used as a
combinatorial Module
0.29
PAC8
Average contribution of a routing net
0.70
PAC9
Contribution of an I/O input pin (standard
dependent)
See Table 2-8 on page 2-6 through
Table 2-10 on page 2-7.
PAC10
Contribution of an I/O output pin (standard
dependent)
See Table 2-11 on page 2-8 through
Table 2-13 on page 2-9.
PAC11
Average contribution of a RAM block during a
read operation
25.00
PAC12
Average contribution of a RAM block during a
write operation
30.00
PAC13
Dynamic contribution for PLL
2.60
Note: *For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi Power
spreadsheet calculator or SmartPower tool in Libero SoC software.



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