AGLP030 datasheet(20/134 Pages) MICROSEMI

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IGLOO PLUS DC and Switching Characteristics

2-6

Revision 16

Thermal Characteristics

Introduction

The temperature variable in the Microsemi Designer software refers to the junction temperature, not the

ambient temperature. This is an important distinction because dynamic and static power consumption

cause the chip junction temperature to be higher than the ambient temperature.

EQ 1 can be used to calculate junction temperature.

TJ = Junction Temperature = T + TA

EQ 1

where:

TA = Ambient temperature

T = Temperature gradient between junction (silicon) and ambient T = ja * P

ja = Junction-to-ambient of the package. ja numbers are located in Figure 2-5.

P = Power dissipation

Package Thermal Characteristics

The device junction-to-case thermal resistivity is

jc and the junction-to-ambient air thermal resistivity is

ja. The thermal characteristics for ja are shown for two air flow rates. The maximum operating junction

temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation

allowed for a 484-pin FBGA package at commercial temperature and in still air.

EQ 2

Temperature and Voltage Derating Factors

Maximum Power Allowed

Max. junction temp. (

C) Max. ambient temp. (C)

–



ja(C/W)

------------------------------------------------------------------------------------------------------------------------------------------

100

C70C

–

20.5°C/W

-------------------------------------

1.46 W

Table 2-5 • Package Thermal Resistivities

Package Type

Count

jc

ja

Units

Still Air

200 ft./

min.

500 ft./

min.

Chip Scale Package (CSP)

CS201

TBD

C/W

CS281

TBD

C/W

CS289

TBD

C/W

Very Thin Quad Flat Package (VQFP)

VQ128

TBD

C/W

VQ176

TBD

C/W

Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,

VCC = 1.425 V)

For IGLOO PLUS V2 or V5 devices, 1.5 V DC Core Supply Voltage

Array Voltage

VCC (V)

Junction Temperature (°C)

–40°C

0°C

25°C

70°C

85°C

100°C

1.425

0.934

0.953

0.971

1.000

1.007

1.013

1.5

0.855

0.874

0.891

0.917

0.924

0.929

1.575

0.799

0.816

0.832

0.857

0.864

0.868

AGLP030 датащи(PDF) 20 Page - Microsemi Corporation

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