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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AGLP030 датащи(PDF) 99 Page - Microsemi Corporation |
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AGLP030 датащи(HTML) 99 Page - Microsemi Corporation |
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99 / 134 page  IGLOO PLUS Low Power Flash FPGAs Revision 16 3-5 Special Function Pins NC No Connect This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be left floating with no effect on the operation of the device. DC Do Not Connect This pin should not be connected to any signals on the PCB. These pins should be left unconnected. Packaging Semiconductor technology is constantly shrinking in size while growing in capability and functional integration. To enable next-generation silicon technologies, semiconductor packages have also evolved to provide improved performance and flexibility. Microsemi consistently delivers packages that provide the necessary mechanical and environmental protection to ensure consistent reliability and performance. Microsemi IC packaging technology efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition, Microsemi offers a variety of packages designed to meet your most demanding application and economic requirements for today's embedded and mobile systems. Related Documents IGLOO PLUS Device Family User’s Guide http://www.microsemi.com/soc/documents/IGLOOPLUS_UG.pdf The following documents provide packaging information and device selection for low power flash devices. Product Catalog http://www.microsemi.com/soc/documents/ProdCat_PIB.pdf Lists devices currently recommended for new designs and the packages available for each member of the family. Use this document or the datasheet tables to determine the best package for your design, and which package drawing to use. Package Mechanical Drawings http://www.microsemi.com/soc/documents/PckgMechDrwngs.pdf This document contains the package mechanical drawings for all packages currently or previously supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings. Additional packaging materials are available at http://www.microsemi.com/soc/products/solutions/package/docs.aspx. |
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