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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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R5F10RB8AFP датащи(PDF) 32 Page - Renesas Technology Corp |
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R5F10RB8AFP датащи(HTML) 32 Page - Renesas Technology Corp |
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32 / 76 page  RL78/L12 2. ELECTRICAL SPECIFICATIONS (TARGET) Page 32 of 73 R01DS0157EJ0001 Rev.0.01 2012.02.20 Under development Preliminary document Specifications in this document are tentative and subject to change. Notes 1. Total current flowing into VDD and EVDD, including the input leakage current flowing when the level of the input pin is fixed to VDD, EVDD or VSS, EVSS. The values below the MAX. column include the peripheral operation current. However, not including the current flowing into the A/D converter, LVD circuit, I/O port, and on-chip pull-up/pull-down resistors. 2. During HALT instruction execution by flash memory. 3. When high-speed on-chip oscillator and subsystem clock are stopped. 4. When high-speed system clock and subsystem clock are stopped. 5. When operating real-time clock (RTC) and setting ultra-low current consumption (AMPHS1 = 1). When high-speed on-chip oscillator and high-speed system clock are stopped. When watchdog timer is stopped. 6. When high-speed on-chip oscillator, high-speed system clock, and subsystem clock are stopped. When watchdog timer is stopped. 7. Relationship between operation voltage width, operation frequency of CPU and operation mode is as below. High speed operation: VDD = 2.4 V to 5.5 V@1 MHz to 24 MHz Low speed operation: VDD = 1.8 V to 5.5 V@1 MHz to 8 MHz Low voltage operation: VDD = 1.6 V to 5.5 V@1 MHz to 4 MHz Remarks 1. fMX: High-speed system clock frequency (X1 clock oscillation frequency or external main system clock frequency) 2. fIH: High-speed on-chip oscillator clock frequency 3. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency) 4. Except subsystem clock operation and STOP mode, temperature condition of the TYP. value is TA = 25 °C |
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