PIC32MX795F512LT-80ISLASHPF datasheet(241/256 Pages) MICROCHIP

241 / 256 page

DS61156G-page 241

PIC32MX5XX/6XX/7XX

4.0 “Memory Organization”

Updated all register tables to include the Virtual Address and All Resets

columns.

Updated the title of Figure 4-4 to include the PIC32MX575F256L device.

Updated the title of Figure 4-6 to include the PIC32MX695F512L and

PIC32MX695F512H devices. Also changed PIC32MX795F512L to

PIC32MX795F512H.

Updated the title of Table 4-3 to include the PIC32MX695F512H device.

Updated the title of Table 4-5 to include the PIC32MX575F5256L device.

Updated the title of Table 4-6 to include the PIC32MX695F512L device.

Reversed the order of Table 4-11 and Table 4-12.

Reversed the order of Table 4-14 and Table 4-15.

Updated the title of Table 4-15 to include the PIC32MX575F256L and

PIC32MX695F512L devices.

Updated the title of Table 4-45 to include the PIC32MX575F256L device.

Updated the title of Table 4-47 to include the PIC32MX695F512H and

PIC32MX695F512L devices.

12.0 “I/O Ports”

Updated the second paragraph of 12.1.2 “Digital Inputs” and removed Table

12-1.

22.0 “10-bit Analog-to-Digital

Converter (ADC)”

Updated the ADC Conversion Clock Period Block Diagram (see Figure 22-2).

28.0 “Special Features”

Removed references to the ENVREG pin in 28.3 “On-Chip Voltage

Regulator”

Updated the first sentence of 28.3.1 “On-Chip Regulator and POR” and

28.3.2 “On-Chip Regulator and BOR”

Updated the Connections for the On-Chip Regulator (see Figure 28-2).

31.0 “Electrical Characteristics”

Updated the Absolute Maximum Ratings and added Note 3.

Added Thermal Packaging Characteristics for the 121-pin XBGA package

(see Table 31-3).

Updated the Operating Current (IDD) DC Characteristics (see Table 31-5).

Updated the Idle Current (IIDLE) DC Characteristics (see Table 31-6).

Updated the Power-Down Current (IPD) DC Characteristics (see Table 31-7).

Removed Note 1 from the Program Flash Memory Wait State Characteristics

(see Table 31-12).

Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics,

changing SP52 to SP35 between the MSb and Bit 14 on SDOx (see

Figure 31-13).

32.0 “Packaging Information”

Added the 121-pin XBGA package marking information and package details.

“Product Identification System”

Added the definition for BG (121-lead 10x10x1.1 mm, XBGA).

Added the definition for Speed.

TABLE B-1:

MAJOR SECTION UPDATES (CONTINUED)

Section Name

Update Description

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