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ADSP-21469KBZ-ENG2 датащи(PDF) 51 Page - Analog Devices |
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ADSP-21469KBZ-ENG2 датащи(HTML) 51 Page - Analog Devices |
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51 / 56 page ![]() ADSP-21469/ADSP-21469W Preliminary Technical Data Rev. PrB | Page 51 of 56 | November 2008 THERMAL CHARACTERISTICS The ADSP-21469 processor is rated for performance over the temperature range specified in Operating Conditions on Page 16. Table 47 airflow measurements comply with JEDEC standards JESD51-2 and JESD51-6 and the junction-to-board measure- ment complies with JESD51-8. Test board design complies with JEDEC standards JESD51-7 (PBGA). The junction-to-case mea- surement complies with MIL- STD-883. All measurements use a 2S2P JEDEC test board. To determine the junction temperature of the device while on the application PCB, use: where: TJ = junction temperature °C TCASE = case temperature (°C) measured at the top center of the package ΨJT = junction-to-top (of package) characterization parameter is the Typical value from Table 47. PD = power dissipation Values of θJA are provided for package comparison and PCB design considerations. θJA can be used for a first order approxi- mation of TJ by the equation: where: TA = ambient temperature °C Values of θJC are provided for package comparison and PCB design considerations when an external heatsink is required. Values of θJB are provided for package comparison and PCB design considerations. Note that the thermal characteristics val- ues provided in Table 47 are modeled values. Figure 44. Typical Output Delay or Hold vs. Load Capacitance (at Ambient Temperature) 8 0 0 100 250 12 4 2 10 6 200 150 50 TBD T J T CASE Ψ JT P D × () + = T J T A θ JA P D × () + = Table 47. Thermal Characteristics for 324-Lead PBGA Parameter Condition Typical Unit θJA Airflow = 0 m/s TBD °C/W θJMA Airflow = 1 m/s TBD °C/W θJMA Airflow = 2 m/s TBD °C/W θJC TBD °C/W ΨJT Airflow = 0 m/s TBD °C/W ΨJMT Airflow = 1 m/s TBD °C/W ΨJMT Airflow = 2 m/s TBD °C/W |
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