13892 datasheet(11/161 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

13892

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Charger and USB Input Voltage(5)

VCHRGR

-0.3 to 20

MODE pin Voltage

VMODE

-0.3 to 9.0

Main/Aux/Keypad Current Sink Voltage

VLEDMD,

VLEDAD,

VLEDKP

-0.3 to 28

Battery Voltage

VBATT

-0.3 to 4.8

Coin Cell Voltage

VLICELL

-0.3 to 3.6

ESD Voltage(6)

Human Body Model - HBM with Mode pin excluded(9)

Charge Device Model - CDM

VESD

±1500

±250

THERMAL RATINGS

Ambient Operating Temperature Range

-30 to +85

°C

Operating Junction Temperature Range

-30 to +125

°C

Storage Temperature Range

TSTG

-65 to +150

°C

THERMAL RESISTANCE

Peak Package Reflow Temperature During Reflow(7), (8)

TPPRT

Note 8

°C

Notes

USB Input Voltage applies to UVBUS pin only

ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 W) and the Charge Device

Model (CDM), Robotic (CZAP = 4.0pF).

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Mode Pin is not ESD protected.

Table 4. Dissipation Ratings

Rating Parameter

Condition

Symbol

VK Package

VL Package

Unit

Junction to Ambient Natural Convection

Single layer board (1s)

RθJA

104

°C/W

Junction to Ambient Natural Convection

Four layer board (2s2p)

RθJMA

°C/W

Junction to Ambient (@200 ft/min)

Single layer board (1s)

RθJMA

°C/W

Junction to Ambient (@200 ft/min)

Four layer board (2s2p)

RθJMA

°C/W

Junction to Board

RθJB

°C/W

Junction to Case

RθJC

°C/W

Junction to Package Top

Natural Convection

θJT

7.0

5.0

°C/W

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