13892 datasheet(86/161 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

13892

FUNCTIONAL DEVICE OPERATION

SUPPLIES

with a dual camera, it is anticipated that only one of the two cameras is active at a time, allowing the VCAM supply to be shared

between them.

VCAM has an internal PMOS pass FET which will support up to 2 Mpixel Camera modules (<65 mA). To support higher

resolution cameras, an external PNP is provided. The external PNP configuration is offered to avoid excess on-chip power

dissipation at high loads, and large differential between BP and output settings. For lower current requirements, an integrated

PMOS pass FET is included. The input pin for the integrated PMOS option is shared with the base current drive pin for the PNP

option. The external PNP configuration must be committed as a hardwired board level implementation, while the operating mode

is selected through the VCAMCONFIG bit after startup. The VCAM is not automatically enabled during the power up sequence,

allowing software to properly set the VCAMCONFIG bit before the regulator is activated. The recommended PNP device is the

ON Semiconductor NSS12100XV6T1G which is capable of handling up to 250 mW of continuous dissipation at a minimum

footprint and 75 °C of ambient. For use cases where up to 500 mW of dissipation is required, the recommended PNP device is

the ON Semiconductor NSS12100UW3TCG. For stability reasons a small minimum ESR may be required.

The input VINCAM should always be connected to BP, even if the VCAM regulator is not used by the system.

MULTI-MEDIA CARD SUPPLY

This supply domain is generally intended for user accessible multi-media cards, such as Micro-SD (TransFlash), RS-MMC,

and the like. An external PNP is utilized for this LDO to avoid excess on-chip power dissipation at high loads and large differential

between BP and output settings. The external PNP device is always connected to the BP line in the application. VSD may also

be applied to other system needs within the guidelines of the regulator specifications. The recommended PNP device is the ON

Semiconductor NSS12100XV6T1G, which is capable of handling up to 250 mW of continuous dissipation at a minimum footprint

and 75 °C of ambient. For use cases where up to 500 mW of dissipation is required, the recommended PNP device is the ON

Semiconductor NSS12100UW3TCG. For stability reasons a small minimum ESR may be required. At the 1.8 V set point, the

VSD regulator can be powered from an external buck switcher (2.2 V typ) for an efficiency advantage and reduced power

dissipation in the pass devices.

GEN1, GEN2, AND GEN3 REGULATORS

General purpose LDOs VGEN1, VGEN2, and VGEN3 are provided for expansion of the power tree to support peripheral

devices, which could include WLAN, BT, GPS, or other functional modules. All the regulators include programmable set points

for system flexibility. At the 1.2 V and 1.5 V set points, both VGEN1 and VGEN2 can be powered from an external buck switcher

(2.2 V typ) for an efficiency advantage, and reduced power dissipation in the pass devices. (Note that a connection to BP or the

external buck switcher as the input to the regulators is a hardwired board level commitment, and not changed on-the-fly).

Table 56. VCAM Voltage Control

Parameter

Value

Output Voltage

ILoad max

VCAMCONFIG=0

Internal Pass FET

VCAMCONFIG=1

External PNP

VCAM[1:0]

2.5 V

65 mA

250 mA

2.6 V

65 mA

250 mA

2.75 V

65 mA

250 mA

3.00 V

65 mA

250 mA

Table 57. VSD Voltage Control

Parameter

Value

Output Voltage

ILoad max

Input Supply

VSD[2:0]

000

1.80 V

250 mA

BP or External Switcher

001

2.00 V

250 mA

010

2.60 V

250 mA

011

2.70 V

250 mA

100

2.80 V

250 mA

101

2.90 V

250 mA

110

3.00 V

250 mA

111

3.15 V

250 mA

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