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PROASIC3E датащи(PDF) 35 Page - Actel Corporation

номер детали PROASIC3E
подробное описание детали  I/O Structures in IGLOOe and ProASIC3E Devices
PDF  37 Pages
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производитель  ACTEL [Actel Corporation]
домашняя страница  http://www.actel.com
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PROASIC3E датащи(HTML) 35 Page - Actel Corporation

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I/O Structures in IGLOOe and Pro ASIC3E Devices
v1.4
35
Power-Up Behavior
Low-power flash devices are power-up/-down friendly; i.e., no particular sequencing is required for
power-up and power-down. This eliminates extra board components for power-up sequencing,
such as a power-up sequencer.
During power-up, all I/Os are tristated, irrespective of I/O macro type (input buffers, output buffers,
I/O buffers with weak pull-ups or weak pull-downs, etc.). Once I/Os become activated, they are set
to the user-selected I/O macros. Refer to the Power-Up/-Down Behavior of Low-Power Flash Devices
chapter of the ProASIC3 and ProASIC3E handbooks for details.
Drive Strength
Low-power flash devices have up to seven programmable output drive strengths. The user can
select the drive strength of a particular output in the I/O Attribute Editor or can instantiate a
specialized I/O macro, such as OUTBUF_S_12 (slew = low, out_drive = 12 mA).
The maximum available drive strength is 24 mA per I/O. Though no I/O should be forced to source
or sink more than 24 mA indefinitely, I/Os may handle a higher amount of current (refer to the
device IBIS model for maximum source/sink current) during signal transition (AC current). Every
device package has its own power dissipation limit; hence, power calculation must be performed
accurately to determine how much current can be tolerated per I/O within that limit.
I/O Interfacing
Low-power flash devices are 5 V–input– and 5 V–output–tolerant without adding any extra
circuitry. Along with other low-voltage I/O macros, this 5 V tolerance makes these devices suitable
for many types of board component interfacing.
Table 19 shows some high-level interfacing examples using low-power flash devices.
Table 19 • High-Level Interface Examples
Interface
Clock
I/O
Type
Frequency
Type
Signals In
Signals Out
Data I/O
GM
Src Sync
125 MHz
LVTTL
8
8
125 Mbps
TBI
Src Sync
125 MHz
LVTTL
10
10
125 Mbps
XSBI
Src Sync
644 MHz
LVDS
16
16
644 Mbps
XGMI
Src Sync DDR
156 MHz
HSTL1
32
32
312 Mbps
FlexBus 3
Sys Sync
104 MHz
LVTTL
≤ 32
≤ 32
≤ 104
Pos-PHY3/SPI-3
Sys Sync
104
LVTTL
8,16,32
8,16,32
≤ 104 Mbps
FlexBus 4/SPI-4.1
Src Sync
200 MHz
HSTL1
16,64
16,64
200 Mbps
Pos-PHY4/SPI-4.2
Src Sync DDR
≥ 311 MHz
LVDS
16
16
≥ 622 Mbps
SFI-4.1
Src Sync
622 MHz
LVDS
16
16
622 Mbps
CSIX L1
Sys Sync
≤ 250 MHz
HSTL1
32,64,96,128
32,64,96,128
≤ 250 Mbps
Hyper Transport
Sys Sync DDR
≤ 800 MHz
LVDS
2,4,8,16
2,4,8,16
≤ 1.6 Gbps
Rapid I/O Parallel
Sys Sync DDR
250 MHz – 1 GHz
LVDS
8,16
8,16
≤ 2 Gbps
Star Fabric
CDR
LVDS
4
4
622 Mbps
Note: Sys Sync = System Synchronous Clocking, Src Sync = Source Synchronous Clocking, and CDR = Clock and
Data Recovery.



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