DSP56F826 datasheet(22/60 Pages) FREESCALE

22 / 60 page

56F827 Technical Data, Rev. 12

Freescale Semiconductor

Notes:

1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.

Determined on 2s2p thermal test board.

2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC

specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on

a thermal test board with two internal planes (2s2p where s is the number of signal layers and p is the number

of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with the

non-single layer boards is Theta-JMA.

3. Junction to case thermal resistance, Theta-JC (RθJC), was simulated to be equivalent to the measured values

using the cold plate technique with the cold plate temperature used as the "case" temperature. The basic cold

plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal

metric to use to calculate thermal performance when the package is being used with a heat sink.

4. Thermal Characterization Parameter, Psi-JT (

ΨJT), is the "resistance" from junction to reference point

thermocouple on top center of case as defined in JESD51-2.

ΨJT is a useful value to use to estimate junction

temperature in steady state customer environments.

5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and

board thermal resistance.

6. See Section 5.1 from more details on thermal design considerations.

7. TJ = Junction Temperature

TA = Ambient Temperature

Table 3-3 Thermal Characteristics6

Characteristic

Comments

Symbol

Value

Unit

Notes

128-pin LQFP

Junction to ambient

Natural convection

RθJA

50.8

°C/W

Junction to ambient (@1m/sec)

RθJMA

46.5

°C/W

Junction to ambient

Natural convection

Four layer board

(2s2p)

RθJMA

(2s2p)

43.9

°C/W

1,2

Junction to ambient (@1m/sec)

Four layer board

(2s2p)

RθJMA

41.7

°C/W

1,2

Junction to case

RθJC

13.9

°C/W

Junction to center of case

ΨJT

1.2

°C/W

I/O pin power dissipation

P I/O

User Determined

Power dissipation

P D

P D = (IDD x VDD + P I/O)W

Junction to center of case

PDMAX

(TJ - TA) /R

θJA

DSP56F826 датащи(PDF) 22 Page - Freescale Semiconductor, Inc

DSP56F826 датащи(HTML) 22 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60

датащи скачать

ссылки URL