ADS5400IPZP datasheet(45/58 Pages) TI2

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ADS5400

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SLAS611C – OCTOBER 2009 – REVISED JANUARY 2016

10.3 PowerPAD™ Package

The PowerPAD package is a thermally enhanced standard-size IC package designed to eliminate the use of

bulky heatsinks and slugs traditionally used in thermal packages. This package can be mounted using standard

printed circuit board (PCB) assembly techniques, and can be removed or replaced using standard repair

procedures.

The PowerPAD package is designed so that the leadframe die pad (or thermal pad) is exposed on the bottom of

the IC. This provides an extremely low thermal resistance path between the die and the exterior of the package.

The thermal pad on the bottom of the IC can then be soldered directly to the printed circuit board (PCB), using

the PCB as a heatsink.

10.3.1 Assembly Process

1. Prepare the PCB top-side etch pattern including etch for the leads as well as the thermal pad as illustrated in

the Mechanical Data section.

2. It is recommended to place a 9 × 9 array of 13-mil-diameter (0.33 mm) via holes under the package, with the

middle 5 × 5 array of thermal vias exposed.

3. Connect all holes (both those inside and outside the thermal pad area) to an internal copper plane (such as a

ground plane).

4. Do not use the typical web or spoke via-connection pattern when connecting the thermal vias to the ground

plane. The spoke pattern increases the thermal resistance to the ground plane.

5. The top-side solder mask should leave exposed the terminals of the package and the 5 × 5 via array thermal

pad area (6 mm × 6 mm).

6. Cover the entire bottom side of the PowerPAD vias to prevent solder wicking.

7. Apply solder paste to the exposed thermal pad area and all of the package terminals.

For more detailed information regarding the PowerPAD package and its thermal properties, see either the

PowerPAD Made Easy application brief (SLMA004) or the PowerPAD Thermally Enhanced Package application

report (SLMA002).

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