ZAMC4100 datasheet(28/156 Pages) RENESAS

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ZAMC4100 Datasheet

January 26, 2016

2.2.

High-Frequency and Low-Frequency Oscillator

The ZAMC4100 system has two built-in oscillators: OSCH and OSCL. Oscillator OSCH generates the 20 MHz

clock used directly in the MCU chip and divided by 5 in SBC chip. OSCL is a very low-power oscillator which

provides 125kHz clock frequency used by LIN wake-up logic during SLEEP Mode and used as an autonomous

clock for the watchdog timer. When SLEEP Mode is enabled, the SBC switches from OSCH to OSCL clock and

vice versa when SLEEP Mode is exited.

2.3.

Watchdog Timer

The SBC features an integrated watchdog timer (WDT), running on an autonomous 125kHz clock provided by

OSCL oscillator. The WDT enables monitoring unresponsive states within the MCU and the SPI bus.

The WDT will generate configurable time-out intervals and when expired will reset the MCU. To avoid this, the

MCU firmware should periodically reset the WDT via the SPI interface.

The WDT has a separate counter that counts the number of MCU resets (N = 4, 8 as configured in the

WDTCONF register; see Table 3.3). When expired, it generates global reset for the whole system. This

guarantees that all drivers are automatically disabled if abnormal MCU behavior occurs (e.g., frozen code).

2.4.

Analog-to-Digital Converter

The SBC features a high-accuracy 10-bit successive approximation ADC with a front-end multiplexer (MUX) that

selects one of the external or internal input signals for sampling and further processing by the MCU.

The ADC supports three types of external measurements, depending on the configuration setting in the firmware:

ratiometric mode, absolute mode, or temperature measurement using internal current sources. For more details,

refer to section 3.12.2.

Summary of possible measurements:

•

Absolute voltage measurement with internal reference voltage

•

Absolute current measurement with internal reference current

•

Ratiometric measurement

•

Measurements of internal input signals for the ADC:

•

Supply voltage; i.e., the voltage between the VDDE and VSSA pins

•

Internal temperature: the average temperature of the SBC die

•

Current through each half-bridge and high-side driver output (does not include EC mirror driver)

•

Actual output voltage of EC mirror driver (at EC_M pin)

•

Diagnostic measurements, which are used during the self-diagnostic mode

•

External analog inputs AIN1-AIN4. Pins AIN3/TEMP and AIN4/TEMP feature switchable current sources

allowing optional direct connection to external temperature sensors

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