ZAMC4100 datasheet(29/156 Pages) RENESAS

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ZAMC4100 Datasheet

January 26, 2016

2.5.

Output Drivers

The ZAMC4100 features three types of drivers:

•

Half-bridge drivers – Low-side and high-side switches are connected between the positive supply rail

and the negative supply rail

•

High-side drivers – High-side switches connected to the positive supply rail VDDE

•

EC mirror control driver (ECM driver) – Output power stage, digital-to-analog converter (DAC) for

controlling the output voltage level, and analog feedback circuit

Each driver provides the following functionalities:

•

Low-resistance power switches optimized for high-current operation.

•

PWM control available for all half-bridge and high-side drivers.

•

The ECM driver is a special type of power driver designed for electrochromatic mirror control. For more

details, refer to section 3.11.

•

Integrated diagnostic and protection features.

•

Detects high impedance output state.

•

Except for the ECM, all switches have an integrated current measurement capability. If selected, these

signals are digitized by the ADC. For the ECM driver, a dedicated internal channel is implemented for

direct measurement of the actual output voltage (potential at EC_M pin).

All switches use an NMOS device for optimal low resistance channels. For driving the high-side switches, an

integrated charge pump provides voltages higher than VDDE.

2.6.

Driver’s Power Capability and Package Temperature

One of the features of the ZAMC4100 is very low channel resistance; therefore, the package is less likely to

overheat in performance of high current operations. However it is the responsibility of the application design

engineer to properly evaluate thermal behavior in the application to avoid premature safety shutdown by the

internal temperature protection circuitry.

The thermal behavior of the ZAMC4100 is very dependent on the PCB layout, encapsulate material, and heat

sinking. Poor quality PCB layout resulting in high thermal resistance will likely cause over-heating, which will

trigger an over-temperature event and prematurely shut down the driver. It is likely that there will be a delay

before the package junction returns to a safe temperature level, depending on the rate of heat dispersion into the

ambient environment.

The MCU could incorporate additional firmware referred to as Smart Power Management, depending on the

application; for example for an automotive heater mirror, where demand for a high current level can be reduced

by implementing a low-frequency PWM method when the ZAMC4100’s package temperature exceeds a specified

temperature level. This feature is designed to prolong the operation period and therefore enhanced reliability. For

more information, contact IDT’s technical support.

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