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TPS548C26 датащи(PDF) 23 Page - Texas Instruments |
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TPS548C26 датащи(HTML) 23 Page - Texas Instruments |
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23 / 39 page ![]() 8.2.2 Design Requirements This design uses the parameters listed in Design Requirements. Table 8-1. Design Parameters PARAMETER VALUE Input voltage 10.8 V – 13.2 V Output Voltage 3.3 V Output current 35 A Switching frequency 800 kHz 8.2.3 Detailed Design Procedure This design example leverages the requirements for the TPS548C26EVM. The default settings for this device are optimal for this application. The following steps illustrate how to select key components. 8.2.3.1 Inductor Selection In general, a smaller inductance increases loop bandwidth leading to better transient response at the expense of higher current and voltage ripple. The inductor must be selected such that the transient performance and ripple requirements are balanced for a particular design. The recommendation is that the inductor ripple current is kept within the range of 20% to 40% of the desired output current. In this example, a 400-nH, 0.8-mΩ inductor is used. 8.2.3.2 Input Capacitor Selection Input capacitors must be selected to provide reduction in input voltage ripple and high-frequency bypassing, which in return reduces switching stress on the power stage MOSFETs internal to the device. In this example, a 0.1-µF, 25-V, 0402 ceramic capacitor must be placed as close as possible to pin 20 of the device on the same layer as the IC on the PCB. In addition, 6pcs 10-µF ceramic capacitors are used and an optional 270-µF bulk capacitor is used on the input. 8.2.3.3 Output Capacitor Selection To meet the output voltage ripple and load transient requirements, use a 1-µF and 2pcs 22-µF ceramic capacitors local to the output of the inductor. Additionally, use 2pcs 220-µF bulk capacitors on the top-side of the PCB combined with 4pcs 22-µF ceramic capacitors on the bottom-side of the PCB. 8.2.3.4 VCC and VRDV Bypass Capacitor Connect a 2.2-µF, 6.3-V (or 10 V) rated ceramic capacitor to AGND for bypassing of the VCC pin. Connect a 2.2-µF, 6.3-V (or 10 V) rated ceramic capacitor to PGND for bypassing of the VDRV pin. This bypass capacitor must refer to PGND pin 7 - 10 to minimize the length of high-frequency driving current path. Placing a 1-Ω resistor between the VCC and VDRV pin forms a RC filter on VCC pin, which greatly reduces the noise impact from power stage driver circuit. 8.2.3.5 BOOT Capacitor Selection Use a minimum of a 0.1-µF capacitor connected from Phase (pin 25) to Boot (pin 26). An optional series boot resistor of 0 Ω or 2.2 Ω can be added. 8.2.3.6 PG Pullup Resistor Selection The PG output is an open-drain output and must be pulled up externally through a pullup resistor. Place a pullup resistor, within a 1-kΩ to 100-kΩ range, at the PG pin (pin 2). In this example, PG is pulled up to VCC/VDRV with a 10-kΩ resistor. www.ti.com TPS548C26 SLVSGM2 – MARCH 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: TPS548C26 |
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