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TPS548C26 датащи(PDF) 23 Page - Texas Instruments

номер детали TPS548C26
подробное описание детали  TPS548C26 4-V to 16-V Input, 35-A Synchronous Buck Converter with Differential Remote Sense
PDF  39 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
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8.2.2 Design Requirements
This design uses the parameters listed in Design Requirements.
Table 8-1. Design Parameters
PARAMETER
VALUE
Input voltage
10.8 V – 13.2 V
Output Voltage
3.3 V
Output current
35 A
Switching frequency
800 kHz
8.2.3 Detailed Design Procedure
This design example leverages the requirements for the TPS548C26EVM. The default settings for this device
are optimal for this application. The following steps illustrate how to select key components.
8.2.3.1 Inductor Selection
In general, a smaller inductance increases loop bandwidth leading to better transient response at the expense of
higher current and voltage ripple. The inductor must be selected such that the transient performance and ripple
requirements are balanced for a particular design. The recommendation is that the inductor ripple current is kept
within the range of 20% to 40% of the desired output current. In this example, a 400-nH, 0.8-mΩ inductor is
used.
8.2.3.2 Input Capacitor Selection
Input capacitors must be selected to provide reduction in input voltage ripple and high-frequency bypassing,
which in return reduces switching stress on the power stage MOSFETs internal to the device. In this example, a
0.1-µF, 25-V, 0402 ceramic capacitor must be placed as close as possible to pin 20 of the device on the same
layer as the IC on the PCB. In addition, 6pcs 10-µF ceramic capacitors are used and an optional 270-µF bulk
capacitor is used on the input.
8.2.3.3 Output Capacitor Selection
To meet the output voltage ripple and load transient requirements, use a 1-µF and 2pcs 22-µF ceramic
capacitors local to the output of the inductor. Additionally, use 2pcs 220-µF bulk capacitors on the top-side
of the PCB combined with 4pcs 22-µF ceramic capacitors on the bottom-side of the PCB.
8.2.3.4 VCC and VRDV Bypass Capacitor
Connect a 2.2-µF, 6.3-V (or 10 V) rated ceramic capacitor to AGND for bypassing of the VCC pin.
Connect a 2.2-µF, 6.3-V (or 10 V) rated ceramic capacitor to PGND for bypassing of the VDRV pin. This bypass
capacitor must refer to PGND pin 7 - 10 to minimize the length of high-frequency driving current path.
Placing a 1-Ω resistor between the VCC and VDRV pin forms a RC filter on VCC pin, which greatly reduces the
noise impact from power stage driver circuit.
8.2.3.5 BOOT Capacitor Selection
Use a minimum of a 0.1-µF capacitor connected from Phase (pin 25) to Boot (pin 26). An optional series boot
resistor of 0 Ω or 2.2 Ω can be added.
8.2.3.6 PG Pullup Resistor Selection
The PG output is an open-drain output and must be pulled up externally through a pullup resistor. Place a pullup
resistor, within a 1-kΩ to 100-kΩ range, at the PG pin (pin 2). In this example, PG is pulled up to VCC/VDRV with
a 10-kΩ resistor.
www.ti.com
TPS548C26
SLVSGM2 – MARCH 2023
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: TPS548C26



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