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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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DRV8461SPWPR датащи(PDF) 114 Page - Texas Instruments |
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DRV8461SPWPR датащи(HTML) 114 Page - Texas Instruments |
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114 / 117 page  www.ti.com PACKAGE OUTLINE C 8.3 7.9 TYP 42X 0.635 44X 0.27 0.17 2X 13.335 (0.15) TYP 0 - 8 0.15 0.05 1.2 MAX 3.80 2.96 8.00 7.16 0.25 GAGE PLANE 0.75 0.50 A 14.1 13.9 NOTE 3 B 6.2 6.0 2X (0.6) NOTE 5 2X (0.13) NOTE 5 PowerPAD TSSOP - 1.2 mm max height DDW0044E PLASTIC SMALL OUTLINE 4226764/A 05/2021 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MO-153. 5. Features may differ or may not be present. PowerPAD is a trademark of Texas Instruments. TM 1 44 0.08 C A B 23 22 PIN 1 ID AREA SEATING PLANE 0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 1.250 EXPOSED THERMAL PAD 45 1 44 23 22 |
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