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VSC8658 датащи(PDF) 91 Page - Microsemi Corporation |
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VSC8658 датащи(HTML) 91 Page - Microsemi Corporation |
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91 / 95 page ![]() Package Information VMDS-10242 VSC8658 Datasheet Revision 4.1 83 Figure 25 • Package Drawing 8.2 Thermal Specifications Thermal specifications for this device are based on the JEDEC standard EIA/JESD51-2 and have been modeled using a four-layer test board with two signal layers, a power plane, and a ground plane (2s2p PCB). For more information, see the JEDEC standard. Table 91 • Thermal Resistances θJA (°C/W) vs. Airflow (ft/min) Part Order Number θJC θJB 0100 200 VSC8658HJ 4.1 7.3 13.4 13.2 13 VSC8658XHJ 4.1 7.3 13.4 13.2 13 0.50~ 0.70 ( 44 ) 27.00 +/-0.20 25.00 0.30 S C A S B S 13579 11 13 15 17 19 21 23 25 2 4 6 8 10 12 14 16 18 20 22 24 26 A C E G J L N R U W AA AC AE B D F H K M P T V Y AB AD AF A C E G J L N R U W AA AC AE B D F H K M P T V Y AB AD AF 1.00 B E C D A 24.00 Ref. 4.00 * 45 (4 ) 0.06 Heat slug 19.0~20.0 Pin #1 corner 0.20 (4 ) 0.50 S C D S E S 0.10 M C 0.25 M C A B Seating plane Top View Side View Bottom View Note: All dimensions are in millimeters (mm). 30 Typ. 25 23 21 19 17 15 13 11 9 7 5 3 1 26 24 22 20 18 16 14 12 10 8 6 4 2 |
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