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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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S70FS01GS датащи(PDF) 39 Page - Cypress Semiconductor |
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S70FS01GS датащи(HTML) 39 Page - Cypress Semiconductor |
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39 / 141 page  S70FS01GS Document Number: 002-03833 Rev. *C Page 39 of 141 6. Physical Interface 6.1 Connection Diagrams 6.1.1 SOIC 16-Lead Figure 6.1 16-Lead SOIC Package, Top View Note: 1. The RESET# input has an internal pull-up and may be left unconnected in the system if quad mode and hardware reset are not in use. 6.1.2 BGA 24-Ball, 5x5 Ball Footprint (FAB024) Figure 6.2 24-Ball BGA, 5x5 Ball Footprint (FAB024), Top View Notes: 1. Signal connections are in the same relative positions as FAC024 BGA, allowing a single PCB footprint to use either package. 2. The RESET# input has an internal pull-up and may be left unconnected in the system if quad mode and hardware reset are not in use. 6.1.3 Special Handling Instructions for FBGA Packages Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. |
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