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MPC7457 датащи(PDF) 24 Page - Freescale Semiconductor, Inc

номер детали MPC7457
подробное описание детали  RISC Microprocessor Hardware Specifications
PDF  68 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
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MPC7457 датащи(HTML) 24 Page - Freescale Semiconductor, Inc

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MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5
24
Freescale Semiconductor
Electrical and Thermal Characteristics
5.2.4.2
L3 Bus AC Specifications for DDR MSUG2 SRAMs
When using DDR MSUG2 SRAMs at the L3 interface, the parts should be connected as shown in Figure 9. Outputs
from the MPC7457 are actually launched on the edges of an internal clock phase-aligned to SYSCLK (adjusted for
core and L3 frequency divisors). L3_CLK0 and L3_CLK1 are this internal clock output with 90° phase delay, so
outputs are shown synchronous to L3_CLK0 and L3_CLK1. Output valid times are typically negative when
referenced to L3_CLKn because the data is launched one-quarter period before L3_CLKn to provide adequate setup
time at the SRAM after the delay-matched address, control, data, and L3_CLKn signals have propagated across the
printed-wiring board.
Inputs to the MPC7457 are source-synchronous with the CQ clock generated by the DDR MSUG2 SRAMs. These
CQ clocks are received on the L3_ECHO_CLKn inputs of the MPC7457. An internal circuit delays the incoming
L3_ECHO_CLKn signal such that it is positioned within the valid data window at the internal receiving latches. This
delayed clock is used to capture the data into these latches which comprise the receive FIFO. This clock is
asynchronous to all other processor clocks. This latched data is subsequently read out of the FIFO synchronously to
the processor clock. The time between writing and reading the data is set by the using the sample point settings
defined in the L3CR register.
Table 13 provides the L3 bus interface AC timing specifications for the configuration as shown in Figure 9,
assuming the timing relationships shown in Figure 10 and the loading shown in Figure 8.
L3DOHn
L3_DATA[n:n+7],
L3_DP[n/8]
0b000
tL3CHDV,
tL3CLDV
0
tL3CHDX,
tL3CLDX,
0
ps
4
0b001
+ 50
+ 50
0b010
+ 100
+ 100
0b011
+ 150
+ 150
0b100
+ 200
+ 200
0b101
+ 250
+ 250
0b111
+ 300
+ 300
0b111
+ 350
+ 350
Notes:
1. See the MPC7450 RISC Microprocessor Family User’s Manual for specific information regarding L3OHCR.
2. See Table 13 and Table 14 for more information.
3. Approximate delay verified by simulation; not tested or characterized.
4. Default value.
5. Increasing values of L3CLKn_OH delay the L3_CLKn signal, effectively decreasing the output valid and output hold times
of all signals latched relative to that clock signal by the SRAM; see Figure 9 and Figure 11.
Table 12. Effect of L3OHCR Settings on L3 Bus AC Timing (continued)
At recommended operating conditions. See Table 4.
Field Name1
Affected Signals
Value
Output Valid Time
Output Hold Time
Unit
Notes
Parameter
Symbol 2
Change 3
Parameter
Symbol 2
Change 3



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