STM32F303C6 datasheet(94/115 Pages) STMICROELECTRONICS

94 / 115 page

Electrical characteristics

STM32F303x6/x8

94/115

DocID025083 Rev 5

Figure 29. Typical connection diagram using the ADC

1. Refer to Table 61 for the values of RAIN.

2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the

pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy

this, fADC should be reduced.

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 10: Power-supply

scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as

close as possible to the chip.

6.3.19

DAC electrical specifications

Table 66. DAC characteristics

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Unit

VDDA

Analog supply voltage

2.4

3.6

RLOAD(1) Resistive load

DAC output buffer ON (to VSSA )5

RLOAD(1) Resistive load

DAC output buffer ON (to VDDA)25

RO(1)

Output impedance

DAC output buffer OFF

CLOAD(1) Capacitive load

DAC output buffer ON

VDAC_OUT(

Voltage on DAC_OUT

output

Corresponds to 12-bit input code

(0x0E0) to (0xF1C) at VDDA = 3.6 V

and (0x155) and (0xEAB) at VDDA =

2.4 V

0.2

VDDA – 0.2

DAC output buffer OFF

-0.5

VDDA– 1LSB

IDDA(3)

DAC DC current

consumption in quiescent

mode(2)

With no load, middle code (0x800)

on the input

380

µA

With no load, worst code (0xF1C) on

the input.

480

µA

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